industry news
Subscribe Now

Intersil to Showcase Its Power Management and Analog Technology Innovations at Electronica 2014

Milpitas, Calif. – Nov. 3, 2014 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions will showcase its technology innovations at the Electronica international trade show in Munich Germany from November 1114, 2014. Several highly differentiated Intersil products, including bridge drivers, radiation hardened ICs, and analog and sensor ICs will be demonstrated at three distribution partner booths.

Intersil Demonstrations:

  • Macnica’s Booth 167 in Hall A5 will feature a demonstration of Intersil’s breakthrough HIP2103 bridge driver powering a DeWalt® 20V MAX® XR Lithium-ion Brushless Compact Drill.
  • Protec’s Booth 507 in Hall A4 will present Intersil’s industry-leading radiation hardened IC demonstrations for harsh environment and aerospace applications.
  • Avnet Booth 476 in Hall A5 will show Intersil’s analog and sensor product demonstrations addressing a wide variety of consumer and industrial applications, including mobile devices, the smart home, test and measurement systems, medical devices and factory automation equipment.

About Intersil

Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company’s products form the building blocks of increasingly intelligent, mobile and power hungry electronics, enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world’s largest markets, including industrial and infrastructure, mobile computing, automotive and aerospace. For more information about Intersil, visit our website at www.intersil.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Connectivity Solutions for Smart Trailers
Smart trailers can now be equipped with a wide variety of interconnection systems including wire-to-wire, wire-to-board, and high-speed data solutions. In this episode of Chalk Talk, Amelia Dalton and Blaine Dudley from TE Connectivity explore the evolution of smart trailer technology, the different applications within a trailer where connectivity would be valuable, and how TE Connectivity is encouraging innovation in the world of smart trailer technology.
Oct 6, 2023
26,951 views