industry news
Subscribe Now

New Amplicon embedded PC offers maximum PCI/PCIe expansion flexibility in fanless compact design

Brighton, UK, 25th September 2014 – The Impact-E 400 series brings the power of expansion to the Amplicon embedded family. Packaged in a lightweight aluminium chassis, designed for optimal heat dissipation, the Impact-E 400 series has been designed with card expansion at its heart.

The Impact-E 400 further improves on the Amplicon Impact-E series, delivering customisable expansion powered by the Ivy Bridge processor generation, packaged in a fanless compact chassis with options for expansion.

The Impact-E 400 series allows for easy access card expansion in an embedded fanless system. Capable of housing cards up to 220mm in either PCI and/or PCIe configurations.

To enable maximum flexibility Amplicon has introduced two models in this series; the Impact-E 430 and the Impact-E 423.

The Impact-E 423 has been optimised for PCI and mPCIe expansion. This unit allows three primary PCI cards to run at PCI standard 2.3 and two mPCIe for modular expansion. The Impact-E 430 offers further PCIe expansion, totalling two, with two PCI lanes.

Both the Impact-E 430 and Impact-E 423 offer PCIe x16 revision 3.0 allowing for optimal graphics card usage, whilst retaining backward compatibility with older revisions.

The Impact-E 400 series can house up to 16GB DDRIII memory enabling the systems to handle a range of memory intensive applications that some of the larger form factor PCs on the market may struggle to process.

Offering both the Intel Ivy Bridge processor and the QM77 chipset, giving high bandwidth SATA III, Intel HD Graphics 4000 and USB 3.0 for a powerful small form factor IPC.

SATA III allows for faster data transfer speeds of up to 6Gb/s, this ensures the data bus bottleneck which previously hindered data transfer speeds is now a thing of the past. The Impact-E 400 series is able to house two HDD or SSD 2.5” format, allowing for RAID 1, 0 and JBOD (Just a Bunch of Disks).

The Intel HD Graphics 4000, allows for high-resolution across a multi display output configuration using DVI-I, DVI-D and HDMI up to a maximum resolution of 1920*1200, or converting the DVI-I output to analogue VGA giving a maximum of 2048*1536.

Gavin Chalkley, Amplicon’s Industrial Computing Product Specialist stated: “The new Impact-E 400 is the big brother of the Impact-E 300. We have listened to our customers and expanded on the functionality of the Impact-E 300 to offer both PCI and PCIe expansion for custom and off the shelf cards.” 

Further product technical details and documentation can be found here

For further details about Amplicon please visit: www.amplicon.com or watch corporate video

About Amplicon:

Amplicon is a global business with 40 years experience of manufacturing and distribution. Amplicon provides the marketplace with a wide range of complex, connected computer-based measurement and automation systems that can be customised and bundled for easy integration. With a history firmly based in engineering Amplicon has a technically competent workforce backed by a state of the art EMC test facility. Visit www.amplicon.com or contact sales@amplicon.com  for further information. Based in Brighton, East Sussex, Amplicon is certified to ISO9001:2008.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
37,772 views