industry news
Subscribe Now

STMicroelectronics Outlines Always-On 6-Axis Ultra-Performance Accelerometer/Gyroscope Combo that Drops the Power/Space Bar

Geneva, September 9, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile applications[1], today announced its development of the first iNEMO™ Ultra product – an always-on, high-performance 6-axis combination accelerometer and gyroscope that sets new standards for device and system power efficiency, signal noise, and performance in motion sensors. In concert with ST’s ultra-low-power STM32 Microcontrollers, the LSM6DS3 combos will create new possibilities for the development of battery-powered smart sensor systems to be embedded in mobile and wearable devices and innovative objects for the Internet of Things (IoT).

The tiny (2.5mm x 3.0mm x 0.8mm), iNEMO Ultra 6-axis inertial-sensor combo (3-axis accelerometer/3-axis gyroscope) delivers industry-leading noise performance[2] while effectively managing system power with state-of-the-art technology that in testing has proven to be typically 20% more energy-efficient than the best alternative combos in low-power mode while delivering outstanding performance and protecting valuable board real estate.

This is in part, due to the market’s largest “smart” FIFO (First-In First-Out) memory (8kbytes) — at least 2 times larger than any else available. This flexible memory allows the LSM6DS3 to save and batch more data before waking up the system processor, saving overall system power, too. Moreover, ST has leveraged its robust and mature manufacturing processes for the production of its industry-leading micro-machined accelerometers and gyroscopes, while manufacturing its IC interfaces using CMOS technology. This choice supports trimming of dedicated circuits to better match sensing-element characteristics.

“Our new 6-axis ultra-combo is designed to operate at the lowest power and best noise density in the market and will make Internet-of-Things devices far more efficient and convenient,” said Benedetto Vigna, ST Executive Vice President and General Manager of the Analog, MEMS & Sensors Group. “With this latest addition to our industry-leading portfolio, our mastery of our own full supply chain, and the expertise and leadership to build system-level efficiency into everything we make, ST continues to raise the bar for motion-sensor performance.”

The LSM6DS3 will be delivered as an optimized 2-chip system-in-package featuring high-performance 3-axis digital accelerometer and 3-axis digital gyroscope with integrated power-efficient modes down to 0.6mA in always-on working mode. The new combo combines always-on low-power features with superior sensing precision for best-in-class motion detection and analysis with ultra-low noise.

The LSM6DS3’s event-detection interrupts enable efficient and reliable motion tracking and context awareness that is implemented in hardware. This allows for recognition of free-fall events, 6D orientation, tap and double-tap sensing, activity or inactivity, and wake-up events. With ST’s experience in supporting the requirements of the main operating systems, the LSM6DS3 will be able to efficiently process real, virtual, and batch-mode sensors, saving power and enabling faster system reaction time. Indeed, the new combo is designed to implement in hardware Significant Motion, Tilt, Pedometer Functions, and Time Stamp, and to support the data acquisition of an external magnetometer with both hard and soft iron correction.

Finally, the LSM6DS3 will offer hardware flexibility to connect pins with different mode connections to external sensors to fulfill additional functionalities as a sensor hub, auxiliary SPI (Serial Peripheral Interface), and other vital capabilities.

The LSM6DS3 combo will be available in Q4 2014.

[1] Source: IHS Consumer and Mobile MEMS Market Tracker H1 2013

2 Accelerometer = 90 ?g/?Hz (typ) in high-performance mode with Output Data Rate (ODR) @104Hz and 0.6 mg-rms (typ) in high-performance mode ODR @104Hz. 
Gyroscope = 0.007 °/s/?Hz (typ) in high-performance mode @10Hz and 0.07 °/s-rms in high-performance mode with ODR @208Hz.

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2013, the Company’s net revenues were $8.08 billion. Further information on ST can be found at www.st.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Trends and Solutions for Next Generation Energy Storage Systems
Sponsored by Mouser Electronics and onsemi
Increased installations of DC ultra fast chargers, the rise of distributed grid systems, and a wider adoption of residential solar installations are making robust energy storage systems more important than ever before. In this episode of Chalk Talk, Amelia Dalton, Hunter Freberg and Prasad Paruchuri from onsemi examine trends in EV chargers, solar, and energy storage systems, the role that battery storage integration plays in energy storage systems, and how onsemi is promoting innovation in the world of energy storage systems.
Jan 29, 2024
12,715 views