industry news
Subscribe Now

Leading European communications companies and research organizations have launched an EU project developing the future 5th Generation cellular mobile networks

GRENOBLE, France – Aug. 28, 2014 – A consortium of 15 leading telecommunications operators, vendors, research centers and academic institutions have launched “MiWaveS” (Millimeter-Wave Small Cell Access and Backhauling), a European collaborative project whose goal is to develop millimeter-wave (mmW) key radio technologies to provide multi-Gbps data rates to future 5thGeneration cellular mobile networks users.

The global mobile data traffic is expected to increase by orders of magnitude in the next decade, driven by video streaming, web services, cloud computing and machine-to-machine applications. Data rates provided to mobile users are also expected to increase accordingly. The evolution of mobile networks towards these objectives is impeded by major bottlenecks, such as the scarcity of spectrum resources below 6 GHz leading to high interference levels, the public concern about microwave electromagnetic field (EMF) exposure in dense areas, the power consumption of the infrastructure, and the flexibility and robustness of the network.

Dr. Laurent Dussopt, MiWaveS project manager and Leti research engineer, explains that “the flexible spectrum usage of the mmW frequency bands at 60 GHz and 71-86 GHz will enable data transmissions up to 10 Gbps for backhaul and 5 Gbps for mobile users access”. He also indicates that “MiWaveS’ objectives lead to significant challenges on the system architecture, networking functions and algorithms, radio and antenna technologies”.

MiWaveS is expected to have a major impact on the key enabling technologies for the next generation of heterogeneous wireless networks. The deployment of mmW small cells in dense urban areas will not only improve the flexibility of the access infrastructure, but also the spectral and energy efficiency by low-power access points using mmW spectrum resources.

The MiWaveS project is partially funded by the European Commission’s Seventh Framework Program.

(FP7), within the Work Programme for Information and Communication Technologies under the objective “Network of the Future”. This objective supports the development of future network infrastructures that allow the convergence and interoperability of heterogeneous mobile, wired and wireless broadband network technologies as enablers of the future Internet.

The MiWaveS consortium relies on the diverse and complementary expertise of its members: CEA-Leti (FR), Telecom Italia (IT), Orange (FR), Nokia (FI), Intel Mobile Communications (DE), National Instruments Dresden (DE), STMicroelectronics (FR, IT), Sivers IMA (SE), Optiprint (CH), VTT (FI), Tech. Univ. Dresden (DE), Tecnologias Servicios Telematicos y Systemas (ES), Univ. of Rennes 1 (FR), Univ. of Surrey (UK).

The MiWaveS project was launched at the beginning of January 2014, and will last for three years. 

Project Websitehttp://www.miwaves.eu

LinkedIn: http://www.linkedin.com/groups/FP7-MiWaveS-6694097?home=&gid=6694097

Twitter: https://twitter.com/FP7_MiWaveS

About CEA-Leti

By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Visit www.leti.fr for more information.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
25,227 views