industry news
Subscribe Now

Cornell University Autonomous Underwater Vehicle Powered by ADLINK’s Express-HL COM Express® Module Attempts Three-peat

ADLINK Technology, a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced its sponsorship of the Cornell University Autonomous Underwater Vehicle (CUAUV) team’s entry into next week’s 17th Annual International RoboSub competition held at the Space and Naval Warfare Command Research facility in San Diego, CA, from Monday, July 28, through Sunday, August 3.

The CUAUV’s Gemini submarine is powered by ADLINK’s Express-HL COM Express® computer-on-module, featuring a 4th generation quad-core Intel® Core™ i7 processor with Mobile Intel® QM87 Express chipset. The Express-HL acts as Gemini’s lone on-board computer, tasked with all vision processing and decision-making required by the AUV. In addition, the Express-HL COM Express carrier board runs its own controller, as well as communicating with micro-controllers on several custom-built peripheral circuit boards also included in Gemini’s design.

“When we started designing Gemini back in August (2013), we knew that we wanted something smaller and more powerful than the 3rd generation Intel Core i7 processor on Mini-ITX form factor that we used on our 2013 vehicle,” explained Markus Burkardt, CUAUV team leader and Cornell University senior. “We decided that a quad-core computer-on-module was the best option to reduce overall vehicle weight and footprint without giving up performance, so we started contacting vendors for support. We were really happy when ADLINK agreed to be our sponsor.”

The CUAUV team, made up of 43 students from three of Cornell’s colleges, spends more than 20,000 person-hours per year designing its vehicle and has won the annual RoboSub competition four out of the last five years. The team began testing Gemini in pool and lake waters back in June, performing and perfecting anticipated manipulation tasks for the mission elements included in the competition’s obstacle course.

“ADLINK is proud to help with the efforts of such a dedicated and successful group of engineers,” said Elizabeth Campbell, general manager of ADLINK, North America. “The skills they are developing now will directly translate into the design of autonomous vehicles that are critical to many industries, including factory automation, geographic exploration, wildlife and environment preservation, and – of course – national defense.”

ADLINK’s Express-HL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 or Celeron® processor with CPU, memory controller, and graphics processor on the same chip, and is specifically designed for customers who need high-level processing and graphics performance in a long product-life solution. The Express-HL supports Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface (DMI) provide high-speed connectivity to the Intel® QM77or HM86 Express chipset.

The international RoboSub competition is co-sponsored by the Association for Unmanned Vehicle Systems International (AUVSI) Foundation and the U.S. Office of Naval Research (ONR) with the goal of advancing the development of AUVs. The event serves to foster ties between young engineers and organizations developing AUV technologies. The competition mission elements and tasks are designed to simulate real-world challenges, such as visual recognition of objects, navigation, and acoustic sensing. 

About ADLINK

ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and computer-on-modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc. and LiPPERT Embedded Computers GmbH, ADLINK also provides a wide range of rugged by design Extreme Rugged™ and Rugged product lines including single board computers, COMs and systems.

ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Miniaturization Impact on Automotive Products
Sponsored by Mouser Electronics and Molex
In this episode of Chalk Talk, Amelia Dalton and Kirk Ulery from Molex explore the role that miniaturization plays in automotive design innovation. They examine the transformational trends that are leading to smaller and smaller components in automotive designs and how the right connector can make all the difference in your next automotive design.
Sep 25, 2023
27,086 views