industry news
Subscribe Now

STMicroelectronics Slims Ultra-Portable Displays with I2C Serial EEPROMs in Industry-Leading Tiny, Lightweight Package

Geneva, March 17, 2014 – STMicroelectronics is taking serial EEPROM to the next level of miniaturization with its latestUFDFPN5 devices measuring just 1.4mm x 1.7mm.

The low-profile UFDFPN5 package (also known as MLP5) is easy to integrate with standard production processes, is 40% smaller than UFDFPN8, until now the smallest package size in widespread use, and weighs 56% less at only 7mg.

Ideal for building ultra-small and lightweight LCD modules in next-generation notebooks and tablets, the new EEPROM package starts with the M24C16-FMH6TG. This 16Kbit device is compatible with 400kHz and 100kHz I2C™-bus modes, has maximum byte or page write time of 5ms, and draws very low current of 1mA in read or write mode and 1µA in standby. 32Kbit, 64Kbit and 128Kbit variants supporting I2C will follow during 2014.

The M24C16-FMH6TG is available immediately in high volume, priced from $0.17 in the UFDFPN5 package for orders of 1,000 pieces.

 

For further information please go to http://www.st.com/eeprom.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

ROHM Automotive Intelligent Power Device (IPD)
Modern automotive applications require a variety of circuit protections and functions to safeguard against short circuit conditions. In this episode of Chalk Talk, Amelia Dalton and Nick Ikuta from ROHM Semiconductor investigate the details of ROHM’s Automotive Intelligent Power Device, the role that ??adjustable OCP circuit and adjustable OCP mask time plays in this solution, and the benefits that ROHM’s Automotive Intelligent Power Device can bring to your next design.
Feb 1, 2024
12,872 views