industry news
Subscribe Now

InvenSense™ Introduces ICS-40720 World’s First 70 dB MEMS Microphone For Consumer Electronics

SAN JOSE, California, January 7, 2014 – InvenSense, Inc. (NYSE: INVN),  the leading provider of MotionTracking™ sensor system on chip (SoC) and Sound devices, announces the sampling of the ICS-40720 analog MEMS microphone for the CE market to select customers. The ICS-40720 is an RF-hardened, high performance, ultra low-noise, low-power, differential analog output MEMS microphone. This product targets consumer electronic devices such as smartphones, tablets, digital still/video cameras, teleconferencing systems, Bluetooth headsets, notebook PCs, and security/surveillance.

The new InvenSense microphone solution includes an innovative new MEMS sensor and an advanced ultra low-noise signal conditioning amplifier. The ICS-40720 has very high SNR and extended wideband frequency response for excellent sound quality and intelligibility. Low power consumption enables long battery life for portable consumer electronic applications.

“Achieving 70dB SNR is a technological breakthrough for MEMS based microphones. The InvenSense ICS-40720 is a disruptive product, meeting the market requirement for a human-like interface between people and consumer electronics,” said Ali Foughi, Vice President of Marketing and Business Development at InvenSense. “With this introduction, InvenSense has established itself as the leader in audio performance.” 

InvenSense is exhibiting in booth #31407 in South Hall 3 at the 2014 International Consumer Electronics Show taking place in Las Vegas from January 7 – 10, 2014. To schedule press and partner meetings at the show, contact pr@invensense.com. For additional informationand data sheets regarding the ICS-40720, please visit www.invensense.com or contact InvenSense Sales at sales@invensense.com.

About InvenSense 

InvenSense Inc. (NYSE: INVN) is the world’s leading provider of MotionTracking™ sensor system on chip (SoC) and Sound solutions for consumer electronic devices. The company’s patented InvenSense Fabrication Platform and patent-pending MotionFusion™ technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in consumer electronic products including smartphones, tablets, gaming devices, optical image stabilization, and remote controls for Smart TVs. The company’s MotionTracking products are also being integrated into a number of industrial applications. InvenSense is headquartered in San Jose, California and has offices in China, Taiwan, Korea, Japan, Slovakia, and Wilmington, MA. More information can be found at www.invensense.com.

Leave a Reply

featured blogs
Sep 29, 2023
Our ultra-low-power SiWx917 Wi-Fi SoC with an integrated AI/ML accelerator simplifies Edge AI for IoT device makers. Accelerate your AIoT development....
Sep 29, 2023
Cadence has become a contributor-level member of the Automotive Working Group in the Universal Chiplet Interconnect Express (UCIe) Consortium. Last year, the Consortium ratified the UCIe specification, which was established to standardize a die-to-die interconnect for chiplet...
Sep 28, 2023
See how we set (and meet) our GHG emission reduction goals with the help of the Science Based Targets initiative (SBTi) as we expand our sustainable energy use.The post Synopsys Smart Future: Our Climate Actions to Reduce Greenhouse Gas Emissions appeared first on Chip Des...
Sep 27, 2023
On-device generative AI brings many exciting advantages, including cost, privacy, performance and personalization '“ offering significant enhancements in utility, productivity and entertainment with use cases across industries, from the commonplace to the creative....
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

Featured Video

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Sponsored by Intel

With each generation, packing millions of transistors onto shrinking dies gets more challenging. But we are continuing to change the game with advanced, targeted FPGAs for your needs. In this video, you’ll discover how Intel®’s chiplet-based approach to FPGAs delivers the latest capabilities faster than ever. Find out how we deliver on the promise of Moore’s law and push the boundaries with future innovations such as pathfinding options for chip-to-chip optical communication, exploring new ways to deliver better AI, and adopting UCIe standards in our next-generation FPGAs.

To learn more about chiplet architecture in Intel FPGA devices visit https://intel.ly/45B65Ij

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

What are the Differences Between an Integrated ADC and a Standalone ADC?
Sponsored by Mouser Electronics and Microchip
Many designs today require some form of analog to digital conversion but how you implement an ADC into your design can make a big difference when it comes to accuracy and precision. In this episode of Chalk Talk, Iman Chalabi from Microchip and Amelia Dalton investigate the benefits of both integrated ADC solutions and standalone ADCs. They discuss the roles that internal switching noise, process technology, and design complexity play when choosing the right ADC solution for your next design.
Apr 17, 2023
20,476 views