industry news
Subscribe Now

STMicroelectronics Reveals Advanced MEMS Accelerometers Engineered to Withstand Stresses of Modern Mobile Life

Geneva, December 3, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) devices for consumer and mobile applications[1], has unveiled its new state-of-the-art high-performance MEMS accelerometer engineered to withstand increasingly challenging conditions inside the latest smartphones and other portable devices.

With today’s processing-intensive mobile apps and super-slim handset designs, portable electronics are more vulnerable to thermal variation and bending. As OEMs push to deliver new models supporting ever more precise, stable and responsive movement sensing for features such as inclinometer, gesture recognition, gaming, artificial horizon in cameras, indoor navigation, and augmented reality, ST’s new LIS2HH12 3-axis accelerometer introduces an innovative mechanical structure and dedicated processing  to deliver consistent and stable high performance in thermally challenging conditions inside ever-slimmer portable applications.

“The innovative architecture of our new accelerometer represents a significant advance in the design of MEMS devices,” said Benedetto Vigna, Executive Vice President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics. “This next-generation device addresses the need of the mobile industry for higher performance and stability in advanced motion-sensitive applications.”

The LIS2HH12 is housed in an ultra-small 2mm x 2mm x 1mm package, giving designers extra flexibility to meet pc-board layout rules for wireless handsets, and helping achieve a low overall handset profile. The accelerometer has selectable full-scale range of ±2, ±4 or ±8 g and a 16-bit digital output, an integrated temperature sensor, industry-standard I2C and SPI interfaces, a wide analog supply-voltage range of 1.71V to 3.6V, and two programmable interrupt generators that help streamline system design. With typical Zero-g level change versus temperature of ±0.25mg/C, the stability of the LIS2HH12 has improved twice compared with the previously announced devices. Also, the rejection versus bending with a typical offset accuracy of ±30mg has improved by 25% over the existing solutions.

In addition, the LIS2HH12 is board- and  software-compatible with ST’s recently announced LSM303C 2mm x 2mm MEMS eCompass module, enabling OEMs to create differentiated handset products economically by leveraging common hardware and software. Alternatively, the LIS2HH12 accelerometer can be used with ST’s LIS3MDL standalone magnetic sensor to create an eCompass using discrete components.

Engineering samples of the LIS2HH12, in the 2mm x 2mm x 1mm LGA-12 package, are available now. Volume production is expected to start in Q1 2014, with unit pricing at $0.90 for quantities of 1,000 pieces.

[1] IHS: Consumer and Mobile MEMS Market Tracker H1 2013

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2012, the Company’s net revenues were $8.49 billion. Further information on ST can be found at www.st.com.

Leave a Reply

featured blogs
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Power Gridlock
The power grid is struggling to meet the growing demands of our electrifying world. In this episode of Chalk Talk, Amelia Dalton and Jake Michels from YAGEO Group discuss the challenges affecting our power grids today, the solutions to help solve these issues and why passive components will be the heroes of grid modernization.
Nov 28, 2023
20,967 views