industry news
Subscribe Now

CEVA Announces New Application Developer Kit for CEVA-MM3000 Imaging & Vision Platforms

MOUNTAIN VIEW, Calif., – August 5, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of a new Application Developer Kit (ADK) for the CEVA-MM3000 imaging and vision platforms. The ADK was developed in-house and serves to substantially simplify the overall software development experience, shortening the product design cycle and providing significant memory bandwidth and power consumption savings. CEVA’s imaging experts utilized the ADK to develop its new low power Digital Video Stabilizer (DVS) software module, which was also announced today in a separate press release.

Erez Bar-Niv, CTO of CEVA, commented: “Our multimedia product offerings leverage the full breadth of engineering expertise at CEVA, bringing together our processor, algorithm and tools engineering teams to deliver the most robust, end-to-end IP platform for developing advanced computational photography, computer vision and augmented reality applications in the industry. Following several major customer design wins, the growing community of developers creating software for our CEVA-MM3000 platforms is constantly seeking ways to simplify the software development flow in increasingly complex systems environments. The CEVA Application Developer Kit successfully addresses these challenges, bringing new levels of efficiency and productivity for software developers, including those who are traditionally used to working at the CPU level.” 

The CEVA Application Developer Kit (ADK) includes the following tools:

  • CEVA-CV  a standard library of more than 600 programming functions for computer vision processing, based on OpenCV and fully optimized for the CEVA-MM3000 platforms. CEVA-CV enables developers to use pre-optimized standard OpenCV kernels for their target application, resulting in quick time-to-market and optimal performance metrics. For example, CEVAs DVS module leverages a number of these functions, including Harris Corner, KLT feature detection, RANSAC, Kalman and Affine Transform.
  • SmartFrame – a software tool designed to handle all of the system resource requirements, including data transfers, DMA transactions and the execution of kernels, thereby abstracting the system architecture and automating frame handling for the application developer. The SmartFrame tool also supports kernel tunneling, whereby multiple functions can be linked together, minimizing memory bandwidth and overall system power consumption.
  • Real-Time OS (RTOS), Scheduler  DSP task management and scheduling software module, handling task prioritization and task switching.
  • CPU-DSP Link  a set of communication channels and system drivers for both the CPU and DSP platforms, which completely abstracts the CPU-DSP interface for the programmer. Automatic task offloading from the CPU to the DSP occurs through this Link.
  • CV API  software APIs on the CPU for a wide range of computer vision functions, including the CEVA-CV library, enabling the CPU programmer to easily utilize any module running on the DSP, while completely abstracting it.

To address specific customer requirements, these tools are delivered in source code format to CEVA licensees, allowing further customization and modifications.

The Application Developer Kit (ADK) is available for CEVA-MM3000 platform licensees today. 

About CEVA, Inc.

CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA’s IP was shipped in over 1.1 billion devices, powering smartphones from many of the world’s leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.


Leave a Reply

featured blogs
Feb 22, 2024
The new Cadence training website is online! This newly redesigned website provides an overview of our well-respected training methods and courses, plus offerings that might be new to you. Modern design and top-of-the-page navigation make it easy to find just what you need'”q...
Feb 15, 2024
This artist can paint not just with both hands, but also with both feet, and all at the same time!...

featured video

Shape The Future Now with Synopsys ARC-V Processor IP

Sponsored by Synopsys

Synopsys ARC-V™ Processor IP delivers the optimal power-performance-efficiency and extensibility of ARC processors with broad software and tools support from Synopsys and the expanding RISC-V ecosystem. Built on the success of multiple generations of ARC processor IP covering a broad range of processor implementations, including functional safety (FS) versions, the ARC-V portfolio delivers what you need to optimize and differentiate your SoC.

Learn more about Synopsys ARC-V RISC-V Processor IP

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

ROHM's 4th Generation SiC MOSFET
In this episode of Chalk Talk, Amelia Dalton and Ming Su from ROHM Semiconductor explore the benefits of the ROHM’s 4th generation of silicon carbide MOSFET. They investigate the switching performance, capacitance improvement, and ease of use of this new silicon carbide MOSFET family.
Jun 26, 2023
27,965 views