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Laird to Attend 2013 IEEE International Symposium on Electromagnetic Capability

August 1, 2012 – Laird, a global technology company, announced it will be attending the 2013 IEEE International Symposium on Electromagnetic Capability. The event will take place at the Colorado Convention Center in Denver, Colorado, August 6-8, 2013. Laird Technologies will be located at booth #305.  

Laird will be exhibiting several industry-leading EMI solutions including Performance Coatings Products SMD Grounding Contactselastomers and EMI tape. These solutions all address the changing issues in the EMC field including higher cycling, packing densities and environmental trends.  EMI collage LR

Also on display will be ECCOSORB® MF-Thermoplast absorbers. These products are manufactured through injection molding and are ideal solutions for complex 3D shaped parts. They are adaptable to high volume manufacturing to help reduce costs.  

“Laird is an industry leader in EMI and EMC solutions and we have been attending the Symposium for over three decades,” said Gary Fenical, senior EMC engineer at Laird. “This event allows us to display our innovative products and also have the opportunity to discuss where the industry is headed with other 
experts in the field.”   

The 2013 IEEE International Symposium on Electromagnetic Capability is sponsored by the IEEE Electromagnetic Compatibility Society. The program features technical sessions, tutorials and networking events as well as an exhibit hall with hundreds of booths featuring the latest products and services in the EMC field.  

As an industry-leading EMI solutions provider, Laird develops solutions with every available material and form factor. The Company’s engineers and scientists constantly invent and perfect new materials, processes and products to solve EMI problems. To learn more about these solutions from industry-leading technical experts in person, visit the Laird booth.   

About Laird Technologies, Inc.

Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and Performance Materials. Wireless Systems solutions include antenna systems, embedded wireless modules, telematics products and wireless automation and control solutions. Performance Materials solutions include electromagnetic interference shielding, thermal management and signal integrity products. As a leader in the design, supply and support of innovative technology, our products allow people, organisations, machines and applications to connect effectively, helping to build a world where smart technology transforms the way of life. Custom products are supplied to major sectors of the electronics industry including the handset, telecommunications, IT, automotive, public safety, consumer, medical, rail, mining and industrial markets. Providing value and differentiation to our customers through innovation, reliable fulfilment and speed, Laird PLC is listed and headquartered in London, and employs over 9,000 people in more than 58 facilities located in 18 countries.

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