industry news
Subscribe Now

Laird Announces Bluetooth Module for Apple iOS Device

July 30, 2013 – Laird, a global technology company, announced the release of its BTM46x Series Bluetooth® modules. Mass production quantities of modules and the associated development kits are now available directly from Laird. 

Based on the market-leading Cambridge Silicon Radio (CSR) BC04 chipset, the innovative firmware on the BTM46x series allows OEMs to seamlessly support Bluetooth data connectivity for all PCs, smartphones and tablets including Apple iOS devices. The BTM46x firmware enables Apple licensees 
to leverage Bluetooth data connectivity, via the iAP protocol, into their MFI accessories, enabling rapid time to market for their products.  

“With Laird’s BTM46x modules and associated development kit, OEMs can provide cross platform Bluetooth data support in a simple and easy to use module,” said Jonathan Kaye, Laird product manager. “Laird’s embedded firmware provides a seamless data connectivity engine regardless of whether connecting to, or from, Bluetooth enabled Android, Windows, Linux or iOS devices.” 

Key application areas for the BTM46x Series include medical devices, ePOS terminals, barcode scanners, industrial cable replacement, and smartphone/tablet ‘Appcessories’. Every BTM46x Series module is designed to add robust, short-range Bluetooth data connectivity to any device. 

With a compact footprint of 12.5 x 22 mm, the modules deliver maximum range with minimum size. The modules are designed to support a separate power supply for I/O, in addition to including a complete Bluetooth v2.1 protocol stack for increased ease of integration. The BTM46x Series provides support for multi-point connections and includes the following Bluetooth profiles: Serial Port Profile (SPP), HID (Human Interface Device) and Apple’s iAP protocol. BTM46x modules are fully qualified as a Bluetooth End Product, whilst also holding FCC Modular, IC, CE and MIC (Japan) regulatory approvals, enabling designers to quickly integrate the modules into devices without the need for additional qualification resources. 

The available low-cost developer’s kit makes it easy for an OEM to integrate the module and guarantees the fastest route to prototype and then mass production. 

With its world-class engineering and RF expertise, Laird continues to develop technologies and capabilities that make a wirelessly connected world possible. Embedded wireless solutions from Laird include Summit Wi-Fi radio modules, a full line of Bluetooth® radio modules and innovative RAMP radio modules. These unique product solutions are ideal for applications in the industrialmedical, andM2M communications industries. 

About Laird Technologies, Inc.

Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and Performance Materials. Wireless Systems solutions include antenna systems, embedded wireless modules, telematics products and wireless automation and control solutions. Performance Materials solutions include electromagnetic interference shielding, thermal management and signal integrity products. As a leader in the design, supply and support of innovative technology, our products allow people, organisations, machines and applications to connect effectively, helping to build a world where smart technology transforms the way of life. 

Custom products are supplied to major sectors of the electronics industry including the handset, telecommunications, IT, automotive, public safety, consumer, medical, rail, mining and industrial markets. Providing value and differentiation to our customers through innovation, reliable fulfilment and speed, Laird PLC is listed and headquartered in London, and employs over 9,000 people in more than 58 facilities located in 18 countries.

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
22,908 views