industry news
Subscribe Now

Semiconductor Industry Veterans From NVIDIA and Xilinx Join eBeam Initiative as Advisory Members

SAN JOSE, Calif., February 19, 2013? – The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that two semiconductor industry veterans—John Chen, vice president of technology and foundry management at NVIDIA Corporation, and Hugh Durdan, vice president of platform and solution marketing at Xilinx Inc.—have joined the organization as advisory members.  These latest additions bring the total number of eBeam Initiative advisors and corporate members to 44.  The eBeam Initiative also announced today the launch of its video journal The Fine Line as an additional step in fostering education in eBeam technology within the semiconductor industry. 

According to Aki Fujimura, CEO of D2S, Inc., managing company sponsor of the eBeam Initiative, “John and Hugh bring a wealth of experience to the eBeam Initiative.  Their unique industry insight—in particular on the needs and dynamics of the semiconductor fabless community—will prove invaluable in supporting eBeam Initiative efforts to guide the semiconductor ecosystem in developing and commercializing new eBeam technologies that are critical to the future success of semiconductor manufacturing.”

Added Fujimura, “We’re also pleased to present our video journal The Fine Line, which will feature perspectives from industry leaders on the latest developments and breakthroughs associated with eBeam technology.”  The inaugural issue of The Fine Line is now available on the eBeam Initiative website at www.ebeam.org.

Chen has 36 years of experience in the semiconductor industry across integrated device manufacturing, foundry and fabless companies.  Prior to joining NVIDIA in 2004, he held senior executive positions at FlexICs, TSMC, WaferTech and Cypress.  At TSMC, he was vice president and head of R&D, where his responsibilities included advanced mask making among other areas.  Earlier in his career, he worked at Hughes Research Lab and Xerox Palo Alto Research Center where he made contributions in CMOS, including e-beam direct writing, and wrote more than 100 papers and a book titled “CMOS Devices and Technology for VLSI”.  He was elected an IEEE Fellow in 1992 for leadership in and contributions to CMOS device and process technology.  Chen holds a bachelor’s degree in electrical engineering from National Taiwan University, a master’s degree in electrical engineering from the University of Maine, and a doctorate in electrical engineering from the University of California at Los Angeles.  He also holds a master’s degree from the UCLA Executive Engineering Management Program.  Previously a technical advisor for the Industrial Technology Research Institute (ITRI) of Taiwan, Chen now serves on several academic and industry boards.

Durdan is responsible for product definition, tools and IP marketing at Xilinx.  Prior to joining Xilinx, he spent seven years at eSilicon, where he was most recently chief operating officer responsible for all aspects of strategy, customer success, revenue and profitability for a $120 million business.  Earlier in his career, he was vice president and general manager of Altera’s $550 million business in the Computer, Consumer and Industrial vertical markets.  Before that, he held senior management positions at LSI Logic, including vice president and general manager of the Computer and Storage Division and the Consumer Division.  He also led a hardware and software development team for Intel-based server products at Digital Equipment Corporation (DEC).  Durdan received his bachelor’s degree in computer and systems engineering at Rensselaer Polytechnic Institute.

About The eBeam Initiative 

The eBeam Initiative provides a forum for educational and promotional activities regarding new semiconductor manufacturing approaches based on electron beam (eBeam) technologies.  The goals of the Initiative are to reduce the barriers to adoption to enable more integrated circuit (IC) design starts and faster time-to-market while increasing the investment in eBeam technologies throughout the semiconductor ecosystem.  Members and advisors, which span the semiconductor ecosystem, include: Abeam Technologies, Advantest, Alchip Technologies, AMTC, Applied Materials, Artwork Conversion, Aselta Nanographics, Cadence Design Systems, CEA-Leti, D2S, Dai Nippon Printing, EQUIcon Software GmbH Jena, e-Shuttle, eSilicon Corporation, Fastrack Design, Fraunhofer CNT, Fujitsu Semiconductor Limited, GenISys GmbH, GLOBALFOUNDRIES, Grenon Consulting, HOYA Corporation, IMS CHIPS, IMS Nanofabrication AG, JEOL, KLA-Tencor, Mentor Graphics Corporation, Multibeam Corporation, NCS, NuFlare Technology, John Chen from NVIDIA, Petersen Advanced Lithography, Colin Harris from PMC-Sierra, Riko Radojcic from Qualcomm, Samsung Electronics, SoftJin Technologies, STMicroelectronics, Synopsys, tau-Metrix, Tela Innovations, TOOL Corporation, Toppan Printing, Vistec Electron Beam Lithography Group, and Hugh Durdan from Xilinx.  Membership is open to all companies and institutions throughout the electronics industry.  To find out more, please visit www.ebeam.org.

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Exploring the Potential of 5G in Both Public and Private Networks – Advantech and Mouser
Sponsored by Mouser Electronics and Advantech
In this episode of Chalk Talk, Amelia Dalton and Andrew Chen from Advantech investigate how we can revolutionize connectivity with 5G in public and private networks. They explore the role that 5G plays in autonomous vehicles, smart traffic systems, and public safety infrastructure and the solutions that Advantech offers in this arena.
Apr 1, 2024
6,577 views