Hsinchu, Taiwan, Jan. 15 2013– Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, today announced the segment’s first Silicon Integrated Passive Device (IPD) Service. The new service encompasses all design chain aspects from design to turnkey product delivery and uses TSMC’s IPD process technology as its manufacturing component.
Silicon IPD integrates a number of passive components on a single device to create a smaller, thinner foot print that also provides improved performance, less capacitance variation, high stability and improved reliability. It is one on a number of multi-chip integration services that includes System-in-Package (SiP), 2.5D ICs and 3D-IC.
Silicon IPD reduces device area by a factor up to 10 and develops devices as thin as 100-microns. It provides less than 5% capacitance variation with outstanding temperature, voltage and aging stability. To systems manufacturers and OEMs, IPD technology means reduced PCB board size and simplified surface mount technology (SMT) manufacturing.
The new silicon IPD service integrates traditionally discrete passive RF components, such as harmonic filters, couplers, power combiner /divider, and impedance matching circuits. It has been positioned by technology visionaries as the next innovation enabler for RF applications targeting consumer, communications, computer, medical and industrial markets.
“Advanced technology takes on many definitions. We firmly believe that IPD and other multi-chip services will open up cost-effect new frontiers for innovation resulting in products and services that are today only a dream,” said Jim Lai, President of GUC.
About GUC
GLOBAL UNICHIP CORP. (GUC), is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443.
For more information, visit www.guc-asic.com.
