RFMD’s new RFPA520x series of three-stage WiFi PA modules are designed for 802.11b/g/n applications. Each is a high-performance, highly integrated solution with minimal external components, eliminating the need for any external matching components and greatly reducing layout area, bill of materials (BOM), and manufacturing costs for the customer application. Built with an advanced InGaP HBT process, these PAs have high linear output power while maintaining excellent power added efficiency (PAE). RFPA5200 comes in a 4mm x 4mm x 1mm, 10-pin laminate package, while RFPA5201 comes in a 14-pin, 7mm x 7mm Multi-Chip Module (MCM)
Features
- POUT:
- RFPA5200: 27dBm, 5V < 3% Dynamic EVM
- RFPA5201: 29dBm, EVM = 3%; 11n MCS7 HT40
- High PAE:
- RFPA5200: 21%
- RFPA5201: 18.5%
- High gain:
- RFPA5200: 33dB
- RFPA5201: 33.5dB
- Input and output matched to 50?
- Integrated power detector, biasing, harmonic filtering, and enable pin
Applications
- WiFi 802.11 b/g/n applications
- Consumer premise equipment (CPE)
- Picocells, femtocell
- Data cards and terminals
- Wireless access points, gateways, routers and set top box applications
- ISM band transmitter applications
Both parts are available now in production quantities. Pricing for 5000 pieces begins at $1.26 each for RFPA5200 and $2.64 each for RFPA5201.
For more information on RFPA5200, visit
https://estore.rfmd.com/RFMD_Onlinestore/Products/RFMD+Parts/PID-P_RFPA5200.aspx.
For more information on RFPA5201, visit
https://estore.rfmd.com/RFMD_Onlinestore/Products/RFMD+Parts/PID-P_RFPA5201.aspx.
