ANSYS and subsidiary Apache Design will host a complimentary seminar series featuring its industry-leading simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics.
Where: Boston, MA; Santa Clara and Los Angeles, CA; Austin, TX
When: October 11 (Boston); October 18 (Santa Clara); October 24 (Los Angeles); November 1 (Austin)
What: Join ANSYS and Apache for this complimentary technical seminar as we introduce our latest electronics design technology and simulation breakthroughs that will help you to design next-generation electronics products.
Seminar attendees will have the opportunity to interact with colleagues, hear from industry experts, and gain knowledge about the latest technology from ANSYS and Apache, with the opportunity to meet our technical staff
first-hand and discuss your design challenges in these informative technical tracks:
- 20nm Low-Power IC Design
- Signal Integrity and Chip-Package-System
- Antennas and RF
This is an opportunity to get technology updates on ANSYS HFSS, Apache RedHawk, ANSYS SIwave and more. Attendees will be able to see the latest advancements in high-performance computing (HPC) for simulation speed and capacity, as well as hear designers share their experiences meeting power, performance and price targets for their most advanced electronic designs.
For registration and more information about the webinar series, click here for the complete schedule.
