industry news
Subscribe Now

Sidense Exhibiting at MemCon

Ottawa, Canada and Santa Clara, Calif.

What

Sidense will be exhibiting at MemCon and discussing its low-cost, secure and reliable 1T-OTP non-volatile memory (NVM), which provides a field-programmable alternative solution to Flash, mask ROM and eFuse in many OTP and MTP applications. 

Where

Santa Clara Convention Center 
5001 Great America Parkway 
Santa Clara, CA 9505 

When

Tuesday, September 18, 2012

8:30AM to 7:00PM

Who

Jim Lipman, Marketing Director

For more information or to schedule a meeting with Sidense please contact:

Jim Lipman

jim@sidense.com

925-606-1370 

About Sidense 

Sidense Corp. provides secure, very dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes with no additional masks or process steps required. The Company’s innovative one-transistor 1T-Fuse™ architecture provides the industry’s smallest footprint, most reliable and lowest power Logic Non-Volatile Memory (LNVM) IP solution. With over 100 patents granted or pending, Sidense OTP provides a field-programmable alternative solution to Flash, mask ROM and eFuse in many OTP and MTP applications.

Sidense SiPROM, SLP and ULP memory products, embedded in more than 230 customer designs, are available from 180nm down to 28nm and are scalable to 20nm and below. The IP is offered at and has been adopted by all top-tier semiconductor foundries and selected IDMs. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, WHDI, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, please visit www.sidense.com 

About MemCon

The memory industry’s premier technical and ecosystem event has returned for 2012. SoC designers, memory vendors, and IP developers won’t want to miss the chance to network, learn, and contribute during the new MemCon conference.

http://memcon.com/

Leave a Reply

featured blogs
Mar 20, 2026
From machines that see and think, to systems that act, and the humans that nudge them along....

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

Global Coverage With NTN
In this episode of Chalk Talk, Paul Fadlovich from TE Connectivity and Martin Lesund from Nordic Semiconductor and Amelia Dalton explore the what, why and how of NTN technology. They also explore the role that antennas play in satellite communication systems, and how Nordic Semiconductor’s nRF9151 System-in-Package and TE Connectivity’s broad range of antenna solutions can jump start your next global IoT design.
Feb 19, 2026
26,001 views