SAN JOSE, CA–(Marketwire – April 10, 2012) – The SMIC-Cadence flow automates designs with advanced power management features. This production-proven methodology is fully incorporated across the complete and integrated Cadence RTL to GDSII flow, which includes Encounter RTL Compiler, Encounter Conformal Low Power, Encounter Digital Implementation System, Encounter Timing System, Encounter Power System, Cadence QRC, Cadence CMP Predictor and Cadence Physical Verification System.Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that China’s Semiconductor Manufacturing International Corporation (SMIC), one of the world’s leading foundries, has introduced a low-power, advanced-node IC design reference flow using Cadence® Encounter® digital technology and SMIC’s 40-nanometer manufacturing process. This new reference flow offers design teams a predictable and accelerated path to complex SoC designs for a wide range of low-power applications, including the latest consumer electronics products such as tablets and smartphones.
“We have worked closely with Cadence to develop a reference flow that helps our customers accelerate and differentiate their low-power, high-performance chips,” said Tianshen Tang, vice president of SMIC Design Service. “By using this interoperable, low-power, Common Power Format-based flow from RTL to GDSII, design teams can achieve faster time-to-volume for advanced low-power 40-nanometer designs.”
“Cadence and SMIC have teamed to enable joint customers to benefit from a comprehensive set of digital technologies such as flat power aware implementation with timing and signal integrity closure, power domain aware physical synthesis, closed loop low-power verification and physical verification,” said John Murphy, group director, Strategic Alliances at Cadence. “By using this proven flow with the 40-nanometer SMIC manufacturing process, customers have a differentiated approach to low-power design that can get them to market faster with lower power consumption.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
About SMIC
Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and a 200mm fab under construction in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.
For more information, please visit www.smics.com
