industry news
Subscribe Now

Docea Power Unveils Thermal Modeling Solution for Early Architecture Exploration and Optimization, First Demonstrations at DATE 2012

Grenoble, France and San Jose, CA – February 29 , 2012 – Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, today announced the release of its AceThermalModeler™ (ATM) software, a solution for generating compact thermal models for System on Chips (SoCs), 3D ICs, Systems in Package (SiPs) or complete boards.  

Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power management policies to reduce temperature’s peaks, and manage temperature gradients across the system. 

ATM bridges the gap between thermal experts and the system architecture teams to improve productivity. With ATM, thermal experts can give system architects a solution that generates RC compact thermal models that are fast to create and simulate. The system architecture team can then work autonomously to estimate various corner use cases, floorplans, architecture options for multi-core designs, operating points or power management policies impact on temperature across the system. 

Ghislain Kaiser, CEO, Docea Power, commented: “We anticipated very early that temperature will become a challenge for next generation devices. Because of this, we developed a simulator that closes the loop between power and temperature for the first versions of Aceplorer™, our solution for Electronic System Level power modeling and optimization. Now, we complete the flow with ATM, a tool that is easy to use and generates thermal models. With it, system architects can perform both thermal steady state or coupled power and thermal analysis for dynamic application profiles running on different architecture configurations.”  

ATM will be demonstrated at the Design, Automation & Test (DATE) conference in Dresden, Germany, March 12 to 16, 2012.  

About the Need for Thermal Models

Thermal issues are a common challenge to a wide spectrum of electronics applications, from industrial and transportation to wireless chipsets and networking ICs. For all these applications, thermal issues found late in the design cycle translate in additional costs and poor yield or product reliability. Any rework means heavy impact on time-to-market. Enabling early dynamic or steady state estimations of thermal distributions for the most power hungry use cases allows system architects to optimize systems and architectures and avoid loss of revenue due to thermal issues found late in the project. 

About Docea Power

Docea Power develops and commercializes a new generation of methodology and tools for enabling faster more reliable power and thermal modeling at the system level. Based on itsAceplorer platform, the Docea Power solution uses a consistent approach for executing architecture exploration and optimizing power and thermal behavior of electronic systems at an early stage of an electronic design project. The company has offices near Grenoble, France, and in San Jose, California, USA, and sales offices in Japan and Korea. For more information, please visit www.doceapower.com

Leave a Reply

featured blogs
May 20, 2022
This year's NASA Turbulence Modeling Symposium is being held in honor of Philippe Spalart and his contributions to the turbulence modeling field. The symposium will bring together both academic and... ...
May 19, 2022
Learn about the AI chip design breakthroughs and case studies discussed at SNUG Silicon Valley 2022, including autonomous PPA optimization using DSO.ai. The post Key Highlights from SNUG 2022: AI Is Fast Forwarding Chip Design appeared first on From Silicon To Software....
May 12, 2022
By Shelly Stalnaker Every year, the editors of Elektronik in Germany compile a list of the most interesting and innovative… ...
Apr 29, 2022
What do you do if someone starts waving furiously at you, seemingly delighted to see you, but you fear they are being overenthusiastic?...

featured video

EdgeQ Creates Big Connections with a Small Chip

Sponsored by Cadence Design Systems

Find out how EdgeQ delivered the world’s first 5G base station on a chip using Cadence’s logic simulation, digital implementation, timing and power signoff, synthesis, and physical verification signoff tools.

Click here for more information

featured paper

Introducing new dynamic features for exterior automotive lights with DLP® technology

Sponsored by Texas Instruments

Exterior lighting, primarily used to illuminate ground areas near the vehicle door, can now be transformed into a projection system used for both vehicle communication and unique styling features. A small lighting module that utilizes automotive-grade digital micromirror devices, such as the DLP2021-Q1 or DLP3021-Q1, can display an endless number of patterns in any color imaginable as well as communicate warnings and alerts to drivers and other vehicles.

Click to read more

featured chalk talk

Mission Critical Electrical Controls

Sponsored by Mouser Electronics and Littelfuse

If you are working on a mission-critical design, there is a very important list of requirements that you will need to consider for your electromechanical controls including how well they have been tested, availability of inventory, and the quality of the components. In this episode of Chalk Talk, Amelia Dalton chats with John Saathoff from Littelfuse electromechanical solutions offered by Hartland Controls, the benefits Hartland brings to the table when it comes to mission-critical designs, and how you can get started using Hartland Controls for your next design.

Click here for more information about Hartland Controls from Littelfuse