SAN JOSE, Calif., Feb. 29, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its participation in the 9th Annual Global Semiconductor Forum 2012 taking place in Shanghai, China from March 7 through March 9, 2012.
What: Global Semiconductor Forum 2012
Where: Hotel Pudong Shangri-La, Shanghai, China
When: March 7 – 9, 2012
On March 8, Xilinx Senior Vice President and Asia Pacific Executive Leader, Vincent Tong, will join executives from AMEC and IBM in an opening panel discussion of the latest semiconductor market developments and outlook for the future of manufacturing, moderated by Bank of America/Merrill Lynch Analyst Dan Heyler. In an afternoon session on the same day, Tong will highlight the opportunities and challenges at the 28nm process technology node, and the pros and cons of 2.5-D vs. 3-D IC design and manufacturing for today’s semiconductor companies.
Executive Panel
Thursday, March 8
8:30 a.m. – 9:05 a.m., Main Forum Room
Highlighting the latest semiconductor market developments and uncovering the future manufacturing outlook
Opening remarks for the GSF 2012 will kick off with SEMI China President Allen Lu, followed by an executive panel that includes some of the industry’s most knowledgeable leaders highlighting the latest semiconductor market developments. The panel will also explore the future of manufacturing moderated by Dan Heyler, Senior Analyst for Bank of America/Merrill Lynch. Panelists: Vincent Tong, Senior Vice President and Asia Pacific Executive Leader, Xilinx; Gerald Yin, Chairman & CEO, AMEC; Subu Iyer, Senior Fellow, IBM Systems & Technology Group
Afternoon Session
Thursday, March 8
1:45 p.m. – 2:20 p.m., Main Forum Room
Opportunities & Challenges for 28nm and 2.5/3-D IC Design and Manufacturing
Speaker: Vincent Tong, Senior Vice President and Asia Pacific Executive Leader, Xilinx
About Global Semiconductor Forum
Now entering into its ninth year, the Global Semiconductor Forum (GSF) has established itself as the industry’s key invitation-only, interpersonal event for senior decision makers from the world’s leading chip and photovoltaic manufacturers.
An exclusive line up of top level speakers will present on the very latest challenges facing the industry. In the wake of recent economic upheaval, will 2012 be a year that sees semiconductor manufacturers push for a return to normality and stability or should industry players set their sights higher? What lessons have been learnt from the global financial crisis and what does this mean for the electronics industry of today and tomorrow? The need for innovation amongst the leading semiconductor companies is now greater than ever before and, with the market continuing to change at a staggering pace, has flexibility ever been more important?
The Global Semiconductor Forum will be co-located with the Global Electronics Forum (GEF), which will feature representation from Global Heads of Technology, Design, R&D and Procurement from leading end-user manufacturers, completing the entire semiconductor supply chain.
For more information, visit http://www.arena-international.com/gsf/.
About Xilinx
Xilinx is the world’s leading provider of programmable platforms. For more information, visit: http://www.xilinx.com/.
