MOUNTAIN VIEW, Calif., February 01, 2012 – CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of a new silicon-based, software development kit (SDK) for runtime software development based on the CEVA-XC323 DSP architecture. The CEVA-XC323 silicon embedded in the SDK was designed by CEVA and manufactured on a 65nm process, delivering up to 800MHz performance. This level of performance facilitates the design of software-based modems and associated application software, for multiple communication standards, in parallel and in a real-time environment. The SDK platform was defined in collaboration with a Tier 1 handset OEM and is already in use with CEVA customers and partners.
The CEVA-XC SDK enables the full implementation of the physical layer (PHY) signal processing in software for a range of communication standards, including LTE, LTE-Advanced, HSPA+, HSPA, TD-SCDMA, WiFi, DTV demodulation, digital radio, and GPS. The SDK is comprised of the CEVA-XC323 silicon, including CEVA’s innovative Power Scaling Unit (PSU) which enables advanced power management within the SoC, a comprehensive set of optimized DSP software libraries, and a broad range of standard interfaces, enabling easy integration into customer-specific system designs. The kit also includes complete debug, profiling and tracing capabilities in real-time, to enable the modeling of real system conditions well in advance of customer silicon being available. The development kit is supported by CEVA-Toolbox™, a complete software development, debug, and optimization environment.
“Our CEVA-XC silicon-based software development kit significantly accelerates software-defined modem design and development by our customers and partners and enables the full validation of their designs in real-time before taping-out their silicon,” said Eran Briman, vice president of marketing at CEVA. “This fundamentally reduces the cost, risk and design efforts associated with supporting still-evolving standards and bringing multi-mode communication designs to production silicon for our customers.”
The development kit includes: 6.5Gbps optical transceiver, dual port 1Gbps Ethernet, 1GB of DDR2 memories, 64MB SSRAM memories, HDMI in/out ports, dual Serial Rapid IO transceivers, and multiple large FPGA modules open for user programmability to add SoC specific logic. The CEVA-XC323 silicon was manufactured in a 65nm process and includes the CEVA-XC323 DSP, Power Scaling Unit (PSU), two XC-DMA controllers, program cache, 512 KB L1 data and 1MB shared L2 memory, external 64/128-bit AXI master and slave interfaces, 32-bit master APB interface, multiple efficient master/slave memory interfaces, Power Management Unit (PMU), Timers, Interrupt Control Unit (ICU), GPIOs, and more.
Availability
The CEVA-XC SDK is available for purchase today. Contact your local sales office or email info@ceva-dsp.com for more information.
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA’s IP was shipped in over 1 billion devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
