industry news
Subscribe Now

KEMET Offers HiQ-CBR Series Surface Mount Multilayer Ceramic Capacitors for Radio Frequency and Microwave Applications

KEMET has introduced its new HiQ-CBR Series Surface Mount Multilayer Ceramic Capacitors (MLCCs) in C0G dielectric. The HiQ-CBR Series features a robust and exceptionally stable copper base metal electrode dielectric system that provides excellent low loss performance (high Q).

These devices are suitable for many circuit applications including radio frequency (RF) power amplifiers, mixers, oscillators, low noise amplifiers, filter networks, antenna tuning, timing circuits, delay lines, and magnetic resonance imaging (MRI) coils.

Typical applications include critical timing, tuning, bypass, coupling, feedback, filtering, impedance matching, and DC blocking. Field applications include wireless and cellular base stations, wireless LAN, subscriber-based wireless services, wireless broadcast equipment, satellite communications, RF power amplifier (PA) modules, filters, voltage-controlled oscillators (VCOs), PAs, matching networks, RF modules, and medical electronics.

“The addition of the HiQ-CBR Series demonstrates KEMET’s commitment to offer customers a complete line of capacitance solutions. Expansion into Radio Frequency and Microwave products will allow KEMET to bring our world-class service and technology to a broader audience,” said Bill Sloka, KEMET Specialty Product Manager.

“These devices offer extremely low ESR and high self-resonance characteristics, and are well-suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. HiQ-CBR Series capacitors exhibit no change in capacitance with respect to time and voltage and boast a negligible change in capacitance with reference to ambient temperature,” continued Sloka.

This solution can be used in conjunction with KEMET Chip Inductors and Ferrite Beads. To learn more about KEMET HiQ-CBR Series products, please visit www.kemet.com/rf.

Technical Information

  • Operating temperature range of -55°C to +125°C
  • Ultra high quality factor (Q)
  • Base metal electrode (BME) dielectric system
  • C0G Dielectric
  • EIA 0201, 0402, 0603, and 0805 case sizes (inches)
  • DC voltage ratings of 6.3V, 10V, 25V, 50V, 100V, and 250V
  • Capacitance offerings ranging from 0.1pF up to 100 pF
  • Available capacitance tolerances of ±0.05pF, ±0.1pF, ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, and ±10%
  • No piezoelectric noise
  • Low ESR
  • High thermal stability
  • No capacitance change with respect to applied rated DC voltage
  • Negligible capacitance change with respect to temperature
  • No capacitance decay with time
  • Non-polar device, minimizing installation concerns
  • 100% pure matte tin-plated termination finish allowing for excellent solderability

About Kemet

KEMET’s common stock is listed on the NYSE under the symbol “KEM.” At the Investor Relations section of our web site at http://www.KEMET.com/IR, users may subscribe to KEMET news releases and find additional information about our Company. KEMET applies world class service and quality to deliver industry leading, high performance capacitance solutions to its customers around the world and offers the world’s most complete line of surface mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics. Additional information about KEMET can be found at http://www.kemet.com.

Leave a Reply

featured blogs
Feb 24, 2026
How a perfectly good Bosch HVAC system was undermined by preventable mistakes, and a thermostat interface that defies logic....

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

Global Coverage With NTN
In this episode of Chalk Talk, Paul Fadlovich from TE Connectivity and Martin Lesund from Nordic Semiconductor and Amelia Dalton explore the what, why and how of NTN technology. They also explore the role that antennas play in satellite communication systems, and how Nordic Semiconductor’s nRF9151 System-in-Package and TE Connectivity’s broad range of antenna solutions can jump start your next global IoT design.
Feb 19, 2026
9,116 views