industry news
Subscribe Now

Meggitt Sensing Systems Announces Global Market Launch of Endevco Subminiature Surface Mountable Shock Accelerometers

November 3, 2011 – San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has introduced the Endevco® model 71M series, a family of rugged, undamped subminiature surface mountable piezoresistive accelerometers, designed to support a variety of high-g shock measurement requirements.

With available g ranges of 2K, 6K, 20K and 60K, design of the Endevco® model 71M series features a patented, monolithic, four-active arm bridge circuit design (U.S. patent numbers 4,498, 229, 4,605,919 and 4,689,600) incorporating the use of Meggitt’s own proprietary sensing element, machined in-house from a single piece of silicon at its ISO9001 certified MEMS facility in Sunnyvale, California, USA.  This etched silicon chip includes both the inertial mass and strain gages arranged in an active four-arm Wheatstone bridge circuit, complete with a novel on-chip zero balance network. The element is housed within a low-profile, miniature, epoxy sealed subminiature surface mountable package, weighing just 0.06 gram, for minimized mass loading effects.

The low mass, small size and unique construction of the MEMS sensing element allows for high resonance frequency, low output impedance, 3x  over-range, and zero damping for minimal phase shift over its useful frequency range.

The high resonance frequency of the Endevco® 71M series permits their survival in the presence of high-frequency components, in a shock pulse that could otherwise shatter the seismic system of accelerometers having lower resonance frequencies. Because they are undamped, the accelerometers can also accurately respond to fast rise times and short duration shock motion. With a frequency response extending down to dc (steady state), they are ideal for measuring long duration transient shocks while integrating critical acceleration data for velocity and displacement.

Recommended accessories include the model 126 three-channel DC bridge amplifier; the model 136 three-channel signal conditioner; and the model 436 DC differential voltage amplifier. Please note, global sale of this product is subject to International Traffic in Arms Regulations and as such, a license is required for all non-US shipments, with the product also potentially subject to other restrictions on its sale and use. Consult factory for details.  For additional information, visit www.meggittsensingsystems.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Connectivity Solutions for Smart Trailers
Smart trailers can now be equipped with a wide variety of interconnection systems including wire-to-wire, wire-to-board, and high-speed data solutions. In this episode of Chalk Talk, Amelia Dalton and Blaine Dudley from TE Connectivity explore the evolution of smart trailer technology, the different applications within a trailer where connectivity would be valuable, and how TE Connectivity is encouraging innovation in the world of smart trailer technology.
Oct 6, 2023
26,534 views