SANTA CLARA, Calif., October 18, 2011 –
Who: MoSys (NASDAQ: MOSY), a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is exhibiting at TSMC Open Innovation Platform®.
What: TSMC Open Innovation Platform is a two-day conference for TSMC customers and partners. The first day of the event is TSMC OIP Partner Workshop. Partners will receive technical information on 28nm process and design technologies, plus an early look at 20nm design enablement programs in a seminar format. The TSMC OIP Ecosystem Forum will take place on the second day of the event. It is open to TSMC customers and will offer a direct OIP marketing venue to reach these customers.
When: TSMC Open Innovation Platform takes place October 17-18, 2011.
Where: San Jose McEnery Convention Center
150 San Carlos Street
San Jose, CA 95113
More information about MoSys’ participation at Hot Chips and other upcoming conferences is available on its website at http://www.mosys.com/eventCalendar.php.
About MoSys, Inc.
MoSys, Inc. (NASDAQ: MOSY) is a leading provider of high-performance networking memory solutions and high-speed, multi-protocol serial interface intellectual property (SerDes IP). MoSys’ leading edge Bandwidth Engine® ICs combine the company’s patented 1T-SRAM® high-density memory with its SerDes IP and are initially targeted at providing breakthroughs in bandwidth and access performance in next generation networking systems. MoSys’ SerDes IP and DDR3 PHYs support a wide range of data rates across a variety of standards, while its 1T-SRAM memory cores provide a combination of high-density, low-power consumption, high-speed and low cost advantages for high-performance applications. MoSys is headquartered in Santa Clara, California. More information is available on MoSys’ website at www.mosys.com.
