industry news
Subscribe Now

BEEcube Will Be Presenting at SAME 2011

FREMONT, Calif., Oct. 4, 2011 /PRNewswire/ — BEEcube will be presenting at the Sophia Antipolis MicroElectronics (SAME) October 12th at Sophia Antipolis, France.  The presentation “FPGA Based Prototyping Issues, A State of Affairs” is part of the Prototyping, Verification, Validation, Test Technical Conference.

Chen Chang, CEO and Founder, and Joseph Rothman, Sr VP of Marketing and Business Development will do the presentation.  It will cover the current state of the art of FPGA prototyping technology as it relates to new high-speed applications and chip designs including Mixed Signal applications. Some of the topics that will be addressed are: performance bottlenecks, partitioning, real-world interface issues, debugging, unique mixed signal ADC/DAC like prototyping issues.

About BEEcube

BEEcube, a leading provider of advanced system-level FPGA prototyping platforms, was founded in 2006. Spinning out of the University of California, Berkeley, BEEcube’s founders include the best academic minds in Silicon Valley and are credited with founding a number of leading companies, including Atheros Communications.

There are over 200 BEE systems deployed worldwide in major corporations and top universities. Corporations currently using BEE systems include: Xilinx, Microsoft, Oracle, Boeing, Huawei, Lincoln Labs, Aerospace Corporation, and Thales Group. Leading universities include: University of California, Berkeley, Stanford University, Massachusetts Institute of Technology, Imperial College London, Barcelona Super Computing Center, Tokyo University, Tsinghua University, and Peking University.

For more information contact info@beecube.com or visit the website: www.beecube.com. Telephone: (510) 252-1136. Facsimile: (888) 700-8917. BEEcube’s corporate headquarters is based at 39465 Paseo Padre Parkway, Suite 3700, Fremont, CA 94538.

BEEcube, BEE, BEE3, BEE3-W, BEE4, BEE4-W, miniBEE, BEEcube Platform Studio, Honeycomb Architecture, Sting I/O, and Nectar O/S are trademarks of BEEcube Inc. All rights reserved.

BEEcube acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Enabling the Evolution of E-mobility for Your Applications
The next generation of electric vehicles, including trucks, buses, construction and recreational vehicles will need connectivity solutions that are modular, scalable, high performance, and can operate in harsh environments. In this episode of Chalk Talk, Amelia Dalton and Daniel Domke from TE Connectivity examine design considerations for next generation e-mobility applications and the benefits that TE Connectivity’s PowerTube HVP-HD Connector Series bring to these designs.
Feb 28, 2024
9,859 views