ALISO VIEJO, Calif.—Oct. 4, 2011—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its award-winning SmartFusion® customisable system-on-chip (cSoC) family is now available in a “CS288” 288-ball chip scale package (CSP) package. The new small footprint package is designed for a wide range of industrial, military, communications, medical and computational applications such as security cameras, advanced weapon systems, wearable power supplies, optical transponders, flow monitors, oral x-ray sensors, remote heart monitors and single board computers.
“In today’s marketplace, the need for small, thin and lightweight packaging has expanded into industrial and communications applications,” said Rich Kapusta, vice president of marketing, SoC Products Group at Microsemi. “The new CS288 package offers exactly that along with a high number of user I/Os, making it ideal for small form-factor embedded systems across a number of industries. We look forward to continuing the expansion of our product offerings to ensure we provide our customers with the innovative embedded solutions they need.”
Key features include:
- Small 11×11 mm square and only 1.05 mm in height
- Available in leaded & lead-free (RoHS compliant) packages
- Available in commercial and industrial temperature grades
- Available across all densities enabling future proofing of designs
- 135 user IOs including FPGA, microcontroller GPIO and analogue I/Os
- 10/100 Ethernet, external memory controller, with I2C, SPI and UART interfaces
- A complete 100 MHz ARM® Cortex-M3™ 32-bit microcontroller sub-system with up to 500K gates of FPGA and feature rich programmable analogue
Microsemi’s SmartFusion cSoCs are the only devices that integrate an FPGA, a complete microcontroller built around a hard ARM Cortex-M3 processor and programmable analogue, enabling full customisation, IP protection and ease-of-use. Based on Microsemi’s proprietary flash process, SmartFusion devices are ideal for hardware and embedded designers who need a highly integrated SoC that provides more flexibility than traditional fixed-function microcontrollers, and significantly reduces the cost of soft processor cores on traditional FPGAs. For more information, visit www.microsemi.com/soc/.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defence and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analogue and RF devices, mixed-signal and RF integrated circuits, customisable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has more than 2,700 employees globally. Learn more at www.microsemi.com.
