industry news
Subscribe Now

DSM Computer: 4-U Q57 industrial computer in a short 19-inch housing

Munich, July 2011 – DSM Computer’s 19-inch Infinity® 96M1595 industrial computer is based on a powerful industrial ATX mainboard with Intel® Q57 chipset. To provide high performance, it is equipped with an Intel® Core™ i7 quad-core processor or i5 dual-core processor and main memory that can be expanded to 16 GB. A particularly low-cost IPC variant is equipped with the dual-core Intel® Pentium™ CPU G6950. 

With a depth of only 408 mm, the robust 4-U system can also be installed in small switchgear cabinets. When installed in standard-depth switchgear cabinets, more space for the wiring is available behind the 19-inch IPC. A large-area air inlet ensures the optimum cooling of the computer. 

The industrial ATX mainboard used in the Infinity® 96M1595 is characterized by its high reliability. It is equipped with high-quality electrolyte capacitors designed for operation at higher temperatures and so ensure a long service life of the system. The ATX boards are available in an unchanged configuration for as long as five years. 

The industrial mainboard provides a wide choice of standard interfaces. In addition to the 14 USB 2.0 connections (six internal and eight external) and Dual GigaBit LAN, two PS/2 connections, VGA, DVI-D, audio, optional LPT and two COM (RS232) or optionally four COM (one RS232/RS422/RS485) are available. The board also has SATA interfaces for six SATA II 300 drives (RAID 0, 1, 0+1, 5 support), IDE for two enhanced IDE drives and one internal CompactFlash socket. 

A total of seven slots for short cards are available for system expansions: one PCI Express™ x16, one PCI Express™ x8 (four lanes), one PCI Express™ x1, four PCI slots and one ISA (shared with a PCI slot). The IPC provides two externally accessible 5.25 inch drive bays or, as an option, SATA removable frames, such as for four 2.5-inch drives. All operating elements and drives are protected behind a metal door. The power switch, the reset switch and two USB outputs are located on the front side. 

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadenceā€™s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
37,835 views