industry news
Subscribe Now

Molex Secures Samtec as Second-Source Supplier for Interconnect Portfolio Trifecta

LISLE, Ill. July 26, 2011 – Molex Incorporated and Samtec, Inc. today announced the signing of a second-source agreement under which Samtec is licensed to manufacture, market and sell Molex EdgeLine®EXTreme LPHPower™ and EXTreme Ten60Power™ product portfolios worldwide. 

“We are pleased to reach agreement with Samtec to provide OEM manufacturers a reliable new supplier with expertise in established and niche connector markets,” said Ken Stead, Product Manager.  “Recognized for superior industry capabilities, Samtec is well positioned to partner in multi-source marketing and expanding the total available market for these innovative Molex solutions.”

The Molex EdgeLine® Family comprises four dynamic product families (CoEdge, Vertical, Press-fitCoPlanar, EdgeLine Signal & Power) each with unique features and benefits.  These one piece edge card solutions deliver low-cost, flexible and scalable interconnect solutions with numerous mating orientations for a wide range of telecommunications, computing and storage applications.

A mixed, high-current power and signal connector, Molex EXTreme LPHPower™ provides up to 127.0A per linear inch of space and can be mated in a right-angle, co-planar or vertical orientation.  The low-profile (7.50mm) EXTreme LPHPower interconnect can increase free airflow up to 25 percent over standard SSI style connectors.

The Molex EXTreme Ten60Power™ connector is a modular high-current power and signal system in a coplanar and right-angle board-to-board orientation.  The EXTreme Ten60Power connector delivers up to 260.0A per linear inch, representing the highest current density available in a low profile connector on the market.

“Samtec is excited to enter into a licensing agreement to bring customers proven patented solutions from Molex.  As innovators in the electronics marketplace, our joint efforts will reach existing and new markets with these leading edge connector technologies,” concurs Doug Wathen, Product Marketing Development Manager, Samtec, Inc.

Samtec’s new offerings will replicate Molex EXTreme LPHPower™Edgeline® and EXTreme Ten60Power™ products.  The two companies plan to jointly conduct cross testing and safety agency (UL, CAT) approval.  For more information onEXTreme LPHPower™Edgeline® and  EXTreme Ten60Power™ connectors please visit www.molex.com or www.samtec.com.  To receive information on other Molex products and industry solutions, please click here.

About Samtec, Inc.

Founded in 1976, Samtec, Inc. is a privately held worldwide manufacturer of a broad line of electronic interconnects including signal integrity, micro pitch, rugged, and integrated and custom products.  Samtec is ISO/TS 16949:2002, ISO 9001:2000, and ISO 14001:2004 registered with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size.  The Samtec website is www.samtec.com.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military, lighting and solar.  Established in 1938, the company operates 39 manufacturing locations in 16 countries.  The Molex website is www.molex.com.  Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

GaN for Humanoid Robots
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Eric Persson and Amelia Dalton explore why power is the key driver for efficient and reliable robot movements and how GaN technologies can help motor control solutions be more compact, integrated and efficient. They also investigate the role of field-oriented control in humanoid robotic applications and why the choice of a GaN power transistor can make all the difference in your next humanoid robot project!
Apr 20, 2026
14,645 views