IRVINE, Calif., July 19, 2011–Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a new multichip (MCP) memory product that provides a drop-in replacement for the discontinued Micron memory package used in Texas Instruments (TI) processors. The MS29C2G24MAKLA1-XI is the first in a family of planned products, and is available today. The new memory solution is compatible with TI processor families that are enclosed in Micron Technology’s end-of-life (EOL) package-on-package (PoP) 152-pin ball grid array (BGA). The Microsemi replacement package allows users to avoid time-consuming board redesign efforts and protect current design-wins.
The new Microsemi component family is compatible with TI’s Sitara(TM), OMAP(TM), and DaVinci(TM) processors. The initial product has the same footprint as Micron’s MT29C2G24MAKLACG-XIT, providing a replacement for the EOL package. Additional features include LPDDR and LPDDR+ flash and are specifically designed to support TI OMAP35xx, AM37x and DM37x processors.
Key Features
- Extends the life of memory devices in the 152BGA package currently EOL by Micron Technology; provides same form, fit, and function
- Avoids the need for PCB redesign and protects established design wins
- Supports TI processors that employs the use of a PoP memory support chip
Microsemi’s MS29C2G24MAKLA1-XI (OMAP MCP) memory houses 2G (x16) SLC NAND Flash and 1G (x32) Mobile LPDDR MCP combination memory with separate interfaces in a 14mm x 14mm, 152 BGA (ball grid array) package with a 0.65mm pitch. It features 1.8 volt flash and 1.8V LPDDR with an industrial temperature range of -40°C to +85°C and low voltage operation. The company plans to offer 4G-2G and 2G LPDDR versions later this year.
For more information, please contact your local Microsemi sales representative.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and commercial; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, configurable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Irvine, Calif., and has more than 2,800 employees globally. Learn more at www.microsemi.com.
