industry news
Subscribe Now

Silicon Frontline Addresses EDA Industry Bottleneck, Promotes Guaranteed Accurate 3D Post-Layout Extraction at Design Automation Conference

SAN DIEGO, CA–(Marketwire – May 25, 2011) –

Who/What

Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company, in the post-layout verification market focused on solutions for nanometer design applications, is attending the 48th Design Automation Conference (DAC) in San Diego and will show its newest product H3D, the industry’s first commercial 3D hierarchical extractor for post-layout verification. H3D offers hierarchical parasitic extraction, hierarchical netlisting, unlimited capacity and field-solver accuracy. H3D works with design flows from the industry’s leading suppliers.

When/Where

Exhibits
9am-6pm, Monday, June 6, Tuesday, June 7, and Wednesday, June 8, 2011
Booth # 3017
San Diego Convention Center
San Diego, CA

For More Information

To set an appointment, please email info@SiliconFrontline.com.
For more information DAC, please visit http://www.dac.com.
For more information about Silicon Frontline Technology, please visit www.siliconfrontline.com.

About Silicon Frontline’s Products and Guaranteed Accuracy

Silicon Frontline’s post-layout verification software delivers Guaranteed Accuracy, full-chip capacity and performance at least 20 times faster than other commercial field solvers. Users specify the level of accuracy desired, net by net, at the block level or with regular expressions. In this way, the resulting parasitics are guaranteed correct within the specified accuracy range for better design quality.

Silicon Frontline’s software has been used to accurately verify over 300 electronic designs to date. The company’s customers use its software to analyze power devices, improve image sensors, ADCs, flash memories, differential signals and nanometer and Analog Mixed Signal (A/MS) designs. The customer list includes 10 of the world’s top 30 semiconductor companies. In addition, leading foundries have validated Silicon Frontline’s products for use with their nanometer design technologies and reference flows.

F3D (Fast 3D) is used for fast 3D extraction and R3D (Resistive 3D) is used for 3D extraction and analysis of large resistive structures. F3D is chosen for its nanometer and Analog Mixed Signal (A/MS) design verification accuracy, and R3D for analysis that leads to improvements in the reliability and efficiency of semiconductor power devices.

About Silicon Frontline

Silicon Frontline Technology, Inc. provides post-layout verification software that is Guaranteed Accurate and works with existing design flows from major EDA vendors. Using new 3D technology, the company’s software products improve silicon quality for standard and advanced nanometer processes. For more information please visit www.siliconfrontline.com. For sales or general assistance, please emailinfo@SiliconFrontline.com or sft@marubeni-sys.com.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadenceā€™s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Battery-free IoT devices: Enabled by Infineonā€™s NFC Energy-Harvesting
Sponsored by Mouser Electronics and Infineon
Energy harvesting has become more popular than ever before for a wide range of IoT devices. In this episode of Chalk Talk, Amelia Dalton chats with Stathis Zafiriadis from Infineon about the details of Infineonā€™s NFC energy harvesting technology and how you can get started using this technology in your next IoT design. They discuss the connectivity and sensing capabilities of Infineonā€™s NAC1080 and NGC1081 NFC actuation controllers and the applications that would be a great fit for these innovative solutions.
Aug 17, 2023
29,394 views