industry news
Subscribe Now

ZMDI’s Sensor Signal Conditioner ZSSC3170 for Automotive Applications Shrinks Board Space and System BOM

Dresden, Germany, May 5, 2011 – ZMD AG, a global supplier of energy-efficient analog and mixed-signal solutions for automotive, industrial, and medical applications, today introduced a single-chip sensor signal conditioner IC for resistive bridge sensors. This new single chip solution is ZMDI’s first device combining a fast and precise sensor conditioning IC with a robust LIN transceiver. The ZSSC3170 is designed for direct 12V supply provided by the vehicle power system. It enables the development of a complete sensor application with a single IC and helps to save component costs and board space.

The ZSSC3170 targets air-conditioning, level measurement and seat adjustment applications. The ZSSC3170 is ideal for comfort applications in modern cars which require integrated LIN interface.

“The small size of the ZSSC3170 and the robust LIN interface help designers to reduce system space and cost,” stated Steve Ramdin, SSC Product Manager. “By the combination of LIN and sensor signal conditioning in one IC only the sensor element and a few passive components are needed to develop a complete sensor application.”

The integrated LIN transceiver meets the LIN specifications 1.3, 2.0 and 2.1. An EMC immunity of up to ±8kV of the LIN interface makes the ZSSC3170 ideal for the use in cars.

Since the ZSSC3170 is designed for harsh automotive environments, it incorporates special protection circuitry, excellent electromagnetic compatibility and numerous diagnostic features. It also offers an excellent EMC resistance. The device can be calibrated in-system where coefficients are stored in on-chip automotive-grade EEPROM. With ZMDI’s unique single-pass calibration technique, no external trimming components are required. This unique feature further reduces the bill of materials and manufacturing costs. 

The ZSSC3170 operates on supply voltages from 7 to 18 volts and over a temperature range of -40°C to +125°C, or extended up to 150°C. Accuracy is ±0.25% FSO over a temperature range of -20°C to +85°C, ±0.50% FSO at -40°C to 125°C and ±1.00% FSO at -40°C to 150°C. The IC comes as die or in a SSOP20 package.

The ZSSC3170 development kit includes a development board, samples and software for quick and easy evaluation and support for calibrating prototypes. Application notes are available for download.

Pricing and Availability Now

Samples are available now. Packaged parts are priced at €2.30 (USD 3,04) in low quantities.

About ZMDI

Zentrum Mikroelektronik Dresden AG (ZMDI) is a semiconductor company focused on energy efficiency. The company is a leading supplier of innovative, highly-precise, robust and cost-efficient analog and mixed-signal semiconductors which allow for a maximum of energy efficiency and environmental protection in the automotive, mobile medical, industrial automation and consumer markets. The company designs and markets application-specific standard products (ASSPs) and application-specific integrated circuits (ASICs) which are known for their robust, cost-effective performance in demanding environments characterized by high temperature, high voltage, and the need for ultra-low power. Headquartered in Dresden, Germany, ZMDI has 280 employees worldwide and serves customers from its offices in Dresden, Stuttgart, Germany; Milan, Italy; Pocatello, ID, Melville, NY, USA; Tokyo, Japan; Taipei, Taiwan and Seoul, Korea. ZMDI has design centres in Dresden, Stuttgart, Munich, Germany; Varna, Bulgaria and Madison, Wisconsin. See more at www.zmdi.com.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
28,659 views