industry news
Subscribe Now

Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry’s Smallest, Most Advanced 20-Nanometer Process

SANTA CLARA, Calif. and BOISE, Idaho, April 14, 2011 – Intel Corporation and Micron Technology Inc. today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).

The growth in data storage combined with feature enhancements for tablets and smartphones is creating new demands for NAND flash technology, especially greater capacity in smaller designs. The new 20nm 8GB device measures just 118mm2 and enables a 30 to 40 percent reduction in board space (depending on package type) compared to the companies’ existing 25nm 8GB NAND device. A reduction in the flash storage layout provides greater system level efficiency as it enables tablet and smartphone manufacturers to use the extra space for end-product improvements such as a bigger battery, larger screen or adding another chip to handle new features.

Manufactured by IM Flash Technologies (IMFT), Intel and Micron’s NAND flash joint venture, the new 20nm 8GB device is a breakthrough in NAND process and technology design, further extending the companies’ lithography leadership. Shrinking NAND lithography to this technology node is the most cost-effective method for increasing fab output, as it provides approximately 50 percent more gigabyte capacity from these factories when compared to current technology. The new 20nm process maintains similar performance and endurance as the previous generation 25nm NAND technology.

“Close customer collaboration is one of Micron’s core values and through these efforts we are constantly uncovering compelling end-product design opportunities for NAND flash storage,” said Glen Hawk, vice president of Micron’s NAND Solutions Group. “Our innovation and growth opportunities continue with the 20nm NAND process, enabling Micron to deliver cost-effective, value-added solid-state storage solutions for our customers.”

“Our goal is to enable instant, affordable access to the world’s information,” said Tom Rampone, vice president and general manager, Intel Non-Volatile Memory Solutions Group. “Industry-leading NAND gives Intel the ability to provide the highest quality and most cost-effective solutions to our customers, generation after generation. The Intel-Micron joint venture is a model for the manufacturing industry as we continue to lead the industry in process technology and make quick transitions of our entire fab network to smaller and smaller lithographies.”

The 20nm, 8GB device is sampling now and expected to enter mass production in the second half of 2011. At that time, Intel and Micron also expect to unveil samples of a 16GB device, creating up to 128GBs of capacity in a single solid-state storage solution that is smaller than a U.S. postage stamp.

About Micron

Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology Inc., visit www.micron.com.

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

Leave a Reply

featured blogs
Dec 13, 2019
Long gone are the days of simply selling a selling a part, pins in plastic if you will. Between environmental standards, qualification testing, UL ratings, and thermal models; customers have come to expect information about the products they purchase as well. Thermal modeling...
Dec 13, 2019
I'm a firm believer that you can'€™t have too many LEDs; "Show me a flashing LED, and I'll show you a man drooling!"...
Dec 13, 2019
[From the last episode: We summarized the last several weeks of computing posts.] We'€™ve talked about processors and we'€™ve talked about several kinds of memories. Today we'€™re going to focus in on the memory used when a program is running. We'€™re not talking abou...
Dec 13, 2019
Do you know what known good die are? Do you know what wafer sort is? Final test? Wafer Sort After a wafer has been manufactured in the fab, it usually (but not always) goes through wafer sort. This... [[ Click on the title to access the full blog on the Cadence Community sit...