LISLE, Ill. – January, 27, 2011 – Molex Incorporated will showcase its proven expertise in high-speed, high-density, and high-signal integrity interconnect technology at DesignCon 2011, February 1 – 2, Santa Clara, CA. Molex experts will participate in technical paper presentations that feature new interconnect design developments and conduct ongoing product demonstrations of the latest Molex interconnect solutions.
Technical Paper Presentations
Both 40-minute paper presentations will highlight a specific Molex technical and application expertise:
- Wednesday, February 2, 10:15 a.m.: Peerouz Amleshi, engineering manager, will provide a detailed analysis of the design optimization of the 25 Gbps electrical backplane.
- Wednesday, February 2, 11:05 a.m.: David Dunham, director SI engineering and Joon Lee, senior RF project engineer, will examine 2.4mm design optimization with 50 GHz material characterization.
Product Demonstrations
The demonstrations will take place in Molex booth 501 and showcase the company’s commitment to developing next-generation solutions for its customers:
- EXTreme Ten60Power™ HDS and EXTreme LPHPower™: Global Product Manager Michael Bean will highlight how these two low profile power connector systems provide industry leading current density and how airflow can improve the power integrity equation. Attendees can see how airflow affects power supply performance and how Molex connectors enhance system design. For more information please visit www.molex.com/link/ext-power.html
- zQSFP+ and zSFP+: Joe Dambach, global new product development manager and Mike Rowlands, electrical project engineer, will demonstrate a live 25 Gbps differential transmission system using the new zQSFP+ SMT connector. This demonstration will utilize a National Semiconductor transceiver and 25 Gbps BertScope to present transmission performance via eye pattern for a 3 meter passive cable. See one of the first examples of the next generation of high-speed differential signal transmission. For more information, please visit www.molex.com/link/zqsfp+.html
- Impact™ Backplane Connector System: Jairo Guerrero, group product manager, will demonstrate the design flexibility of the Impact system including the new design configurations for the Impact Plus 85-Ohm Backplane Connector and Impact Orthogonal Direct Connector. He will evaluate how vertical add-in cards can be mated to horizontal add-in cards on the opposite side without the need for a midplane while improving the use of space and airflow. For more information please visit www.molex.com/link/impact.html
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military, lighting and solar. Established in 1938, the company operates 39 manufacturing locations in 16 countries. The Molex website is www.molex.com. Follow us atwww.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.
