industry news
Subscribe Now

TI expands its MSP430™ MCU Value Line with 64 devices to give 8-bit developers more options with increased memory and capacitive touch capabilities

DALLAS, TX (January 25, 2011) – Continuing its commitment to provide more low-cost options to 8-bit developers, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced 64 new ultra-low-power MSP430 Value Line microcontrollers (MCUs) that offer 16-bit performance at an 8-bit price. The new MSP430G2xx2 MCUs include integrated capacitive touch IOs, allowing developers to interface directly with capacitive touch pads, eliminating the need for additional hardware and components.  Additionally, the MSP430 MCU Value Line expansion provides extra package and memory options, providing developers with increased design flexibility. Supported by TI’s $4.30 LaunchPad development kit, free software and broad third party support network, the G2xx2 MCUs further enable an easy upgrade to 16-bit performance while maintaining the ultra-low Value Line price. For more information, please visit www.ti.com/430value_phase2-pr-lp.   

Key features and benefits of the Value Line G2xx2 MCUs

  • Integrated capacitive touch IOs eliminate the need for external passive components, reducing system level BOM
  • Increased memory ranges of up to 8KB Flash and 256B RAM to support more advanced  applications
  • Additional package options with increased pin counts (20-pin TSSOP and PDIP) offer more flexibility when programming and designing form factors
  • Optimized efficiency with ultra-low standby power of 0.4 microamps  and <1 microseconds wake-up time as well as integrated intelligent peripherals, such as 10-bit ADCs, UART, comparator and serial communication 
  • Supported by complete hardware and software development environment with free, downloadable software debuggers and compilers, including Code Composer Studio ™ IDE and IAR Embedded Workbench, and $4.30 LaunchPad development kit
  • Code compatible across MSP430 platform providing easy migration path for added scalability

Pricing and availability

The new MSP430G2xx2 MCUs are priced from $0.33 for 100K units and samples are immediately available. The MSP430 MCU Value Line LaunchPad development kit (MSP-EXP430G2) is priced at $4.30 and can be ordered at www.ti.com/430value_phase2-pr-es.    

TI’s broad portfolio of MCUs and software

From general purpose, ultra-low power MSP430 MCUs, to Stellaris® Cortex™-M3-based 32-bit MCUs and high performance, real-time control TMS320C2000™ MCUs, TI offers the broadest range of microcontroller solutions. Designers can accelerate time to market by tapping into TI’s complete software and hardware tools, extensive third-party offerings and technical support.

Find out more about TI’s MSP430 MCU Value Line by visiting the links below:

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun.  A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries.  For more information, go to www.ti.com.

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
21,758 views