featured blogs
Dec 8, 2023
Read the technical brief to learn about Mixed-Order Mesh Curving using Cadence Fidelity Pointwise. When performing numerical simulations on complex systems, discretization schemes are necessary for the governing equations and geometry. In computational fluid dynamics (CFD) si...
Dec 7, 2023
Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....
featured paper
 3D-IC Design Challenges and RequirementsSponsored by Cadence Design Systems While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies. |
featured chalk talk
ADI's ISOverse
Sponsored by Mouser Electronics and Analog Devices
In order to move forward with innovations on the intelligent edge, we need to take a close look at isolation and how it can help foster the adoption of high voltage charging solutions and reliable and robust high speed communication. In this episode of Chalk Talk, Amelia Dalton is joined by Allison Lemus, Maurizio Granato, and Karthi Gopalan from Analog Devices and they examine benefits that isolation brings to intelligent edge applications including smart building control, the enablement of Industry 4.0, and more. They also examine how Analog Devices iCoupler® digital isolation technology can encourage innovation big and small!