EEJournal

fresh bytes
Subscribe Now
August 24, 2018

Where’s Waldo? This robot knows

by Sarah Arken

Read more at Technabob 

Leave a Reply

featured blogs
Introduction to Flashpoint Automatic Volume Meshing in Pointwise
Nov 24, 2021
The need for automatic mesh generation has never been clearer. The CFD Vision 2030 Study called most applied CFD 'onerous' and cited meshing's inability to generate complex meshes on the first... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
More from Cadence...
Beam Me Up Spotty!
Nov 24, 2021
I just saw an amazing video showing Mick Jagger and the Rolling Stones from 2021 mixed with Spot robot dogs from Boston Dynamics....
More from Max's Cool Beans...
Integration Challenges for Multi-Billion-Gate ASICs: Part 1 – Clock Domain Crossing
Nov 23, 2021
We explain clock domain crossing & common challenges faced during the ASIC design flow as chip designers scale up CDC verification for multi-billion-gate ASICs. The post Integration Challenges for Multi-Billion-Gate ASICs: Part 1 – Clock Domain Crossing appeared f...
More from Synopsys...
We Hope to See You at Intel® FPGA Technology Day 2021
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...
More from Intel...

featured video

Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

Sponsored by Cadence Design Systems

3D stacking of ICs is emerging as a preferred solution for chip designers facing a slowdown in Moore’s Law and the rising costs of advanced nodes. However, chip stacking creates new complexities, with extra considerations required for the mechanical, electrical, and thermal aspects of the whole stacked system. Watch this video for an overview of Cadence® Integrity™ 3D-IC, a comprehensive platform for 3D planning, implementation, and system analysis, enabling system-driven PPA for multi-chiplet designs.

Click here for more information

featured paper

4 questions to ask before choosing a Wi-SUN stack

Sponsored by Texas Instruments

Scalability, reliability, security, and speed—these are the advantages that the Wireless Smart Ubiquitous Network (Wi-SUN®) offers to smart cities and the Internet of Things. But as a developer, how can you maximize these advantages in your software design? In this article, TI addresses four questions to help you save development cost and get to market faster with a more streamlined design cycle for your IoT application.

Click to read more

featured chalk talk

High Voltage Charging Solution for Energy Storage & Backup Systems

Sponsored by Mouser Electronics and Maxim Integrated (now part of Analog Devices)

Today there is growing demand for energy storage with more power, longer range, and longer run time. But the question remains: how can we increase our energy storage given the energy storage mediums on the market today? In this episode of Chalk Talk, Amelia Dalton chats with Anthony Huyhn from Analog Devices about the benefits of high voltage energy storage, why stacked battery cells are crucial to these kinds of systems, how high voltage energy storage systems can reduce conduction loss exponentially and what kind of high voltage charging solutions from Analog Devices are on the market today.

Click here for more information about the Maxim Integrated MAX17703 Li-Ion Battery Charger Controller