Dice, in their standard six-sided form, seem like the simplest kind of device—almost a classic embodiment of chance. But a new study of more than 100 examples from the last 2,000 years or so unearthed in the Netherlands shows that they have not always looked exactly the way they do now. What’s more, the shifts in dice’s appearance may reflect people’s changing sense of what exactly is behind a roll—fate, or probability. Continue reading at the Atlantic
 New package technology improves EMI and thermal performance with smaller solution sizeSponsored by Texas Instruments Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP). Click here to download the whitepaper |
