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SpaceX wants to send people to Mars by 2024

Elon Musk says SpaceX is on target to send cargo to Mars in 2022 and people in 2024. The way the company will do it is by focusing its resources on a new vehicle, the Interplanetary Transport System (codename: the BFR). That vehicle will be able to travel to Mars, but can also be used to generate revenue for the company through launching satellites, resupplying the ISS, and going to the Moon.

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featured blogs
Oct 26, 2020
Last week was the Linley Group's Fall Processor Conference. The conference opened, as usual, with Linley Gwenap's overview of the processor market (both silicon and IP). His opening keynote... [[ Click on the title to access the full blog on the Cadence Community s...
Oct 23, 2020
Processing a component onto a PCB used to be fairly straightforward. Through-hole products, or a single or double row surface mount with a larger centerline rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller and con...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren'€™t wobbly and you don'€™t have to strike a key dead center for it to make contact?...

featured video

Better PPA with Innovus Mixed Placer Technology – Gigaplace XL

Sponsored by Cadence Design Systems

With the increase of on-chip storage elements, it has become extremely time consuming to come up with an optimized floorplan with manual methods. Innovus Implementation’s advanced multi-objective placement technology, GigaPlace XL, provides automation to optimize at scale, concurrent placement of macros, and standard cells for multiple objectives like timing, wirelength, congestion, and power. This technology provides an innovative way to address design productivity along with design quality improvements reducing weeks of manual floorplan time down to a few hours.

Click here for more information about Innovus Implementation System

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

featured chalk talk

Using the Graphical PMSM FOC Component in Harmony3

Sponsored by Microchip and Mouser Electronics

Developing embedded software, and particularly configuring your embedded system can be a major pain for development engineers. Getting all the drivers, middleware, and libraries you need set up and in the right place and working is a constant source of frustration. In this episode of Chak Talk, Amelia Dalton chats with Brett Novak of Microchip about Microchip’s MPLAB Harmony 3, with the MPLAB Harmony Configurator - an embedded development framework with a drag-and-drop GUI that makes configuration a snap.

Click here for more information about Microchip Technology MPLAB® X Integrated Development Environment (IDE)