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Sheep have facial recognition capabilities comparable to humans

 

Scientists at the University of Cambridge, led by Professor Jenny Morton, have discovered that sheep can recognize human faces. While you probably won’t see any sheep taking the witness stand to finger criminals, the discovery came from a serious neurological study aimed at gaining a better understanding of neurodegenerative disorders in general and Huntington’s disease in particular.

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featured blogs
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Optimizing a silicon chip at the system level is crucial in achieving peak performance, efficiency, and system reliability. As Moore's Law faces diminishing returns, simply transitioning to the latest process node no longer guarantees substantial power, performance, or c...
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Explore standards development and functional safety requirements with Jyotika Athavale, IEEE senior member and Senior Director of Silicon Lifecycle Management.The post Q&A With Jyotika Athavale, IEEE Champion, on Advancing Standards Development Worldwide appeared first ...
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Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

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Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

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3D-IC Design Challenges and Requirements

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While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

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SLM Silicon.da Introduction
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In this episode of Chalk Talk, Amelia Dalton and Guy Cortez from Synopsys investigate how Synopsys’ Silicon.da platform can increase engineering productivity and silicon efficiency while providing the tool scalability needed for today’s semiconductor designs. They also walk through the steps involved in a SLM workflow and examine how this open and extensible platform can help you avoid pitfalls in each step of your next IC design.
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