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Sensor-embedded plastic wrap makes brain surgery safer

It almost goes without saying that brain surgery requires extreme precision, but there hasn’t been much advancement in brain mapping techniques for the past two decades. What good is a breakthrough procedure if you’re still using bulky, imprecise 1990s-era technology as a guide? Researchers may have a better way: they’ve developed an electrode grid-based brain mapping tool that’s both much easier to wield and far more precise. Instead of relying on the usual metal electrodes, they switched to a conductive polymer that’s so tiny and thin it makes Saran Wrap look ungainly. That, in turn, let them stuff 25 times more electrodes into the same space while slimming their tool down to just 0.0002 inches thick instead of a few tenths of an inch.

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featured blogs
Mar 18, 2024
Innovation in the AI and supercomputing domains is proceeding at a rapid pace, with each new advancement heralding a future more tightly interwoven with the threads of intelligence and computation. Cadence, with the release of its Millennium Platform, co-optimized with NVIDIA...
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Mar 5, 2024
Those clever chaps and chapesses at SiTime recently posted a blog: "Decoding Time: Why Leap Years Are Essential for Precision"...

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

FleClear: TDK’s Transparent Conductive Ag Film
Sponsored by Mouser Electronics and TDK
In this episode of Chalk Talk, Amelia Dalton and Chris Burket from TDK investigate the what, where, and how of TDK’s transparent conductive Ag film called FleClear. They examine the benefits that FleClear brings to the table when it comes to transparency, surface resistance and haze. They also chat about how FleClear compares to other similar solutions on the market today and how you can utilize FleClear in your next design.
Feb 7, 2024
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