By adapting a technology used to build electronic components, researchers at the University of Michigan have developed a new way to manufacture medication. The technique could eventually allow hospitals, pharmacies and doctor’s offices to print drugs on demand, mixing different medications into one easy-to-administer dose.
 3D-IC Design Challenges and RequirementsSponsored by Cadence Design Systems While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies. |
