Over at XKCD, Randall Munroe has predicted the critical vulnerabilities and exposures for 2018.
February 19, 2018
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Oct 25, 2020
https://youtu.be/_xItRYHmGPw Made on my balcony (camera Carey Guo) Monday: The Start of the Arm Era Tuesday: The Gen Arm 2Z Ambassadors Wednesday: CadenceLIVE India: Best Paper Awards Thursday:...
[[ Click on the title to access the full blog on the Cadence Community site. ]...
Oct 23, 2020
Processing a component onto a PCB used to be fairly straightforward. Through-hole products, or a single or double row surface mount with a larger centerline rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller and con...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren't intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren't wobbly and you don't have to strike a key dead center for it to make contact?...
featured Paper
 New package technology improves EMI and thermal performance with smaller solution sizeSponsored by Texas Instruments Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP). Click here to download the whitepaper |