fresh bytes
Subscribe Now

Interactive map of New York City’s dog names

Every bubble of Dognames represents a particular name. Max and Bella lead, followed by Charlie, Coco, and Rocky, and Buddy and Lucky, and so on


Continue reading at Boing Boing

Leave a Reply

featured blogs
Oct 23, 2020
The Covid-19 pandemic continues to impact our lives in both expected and unexpected ways. Unfortunately, one of the expected ways is a drop in charitable donations. Analysts predict anywhere from a 6% decrease '€“ with many planning for a bigger decline than that. Also, mor...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren'€™t wobbly and you don'€™t have to strike a key dead center for it to make contact?...
Oct 23, 2020
At 11:10am Korean time this morning, Cadence's Elias Fallon delivered one of the keynotes at ISOCC (International System On Chip Conference). It was titled EDA and Machine Learning: The Next Leap... [[ Click on the title to access the full blog on the Cadence Community ...

featured video

Better PPA with Innovus Mixed Placer Technology – Gigaplace XL

Sponsored by Cadence Design Systems

With the increase of on-chip storage elements, it has become extremely time consuming to come up with an optimized floorplan with manual methods. Innovus Implementation’s advanced multi-objective placement technology, GigaPlace XL, provides automation to optimize at scale, concurrent placement of macros, and standard cells for multiple objectives like timing, wirelength, congestion, and power. This technology provides an innovative way to address design productivity along with design quality improvements reducing weeks of manual floorplan time down to a few hours.

Click here for more information about Innovus Implementation System

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

Next Generation Connectivity and Control Concepts for Industry 4.0

Sponsored by Mouser Electronics and Molex

Industry 4.0 promises major improvements in terms of efficiency, reduced downtime, automation, monitoring, and control. But Industry 4.0 also demands a new look at our interconnect solutions. In this episode of Chalk Talk, Amelia Dalton chats with Mark Schuerman of Molex about Industry 4.0 and how to choose the right connectors for your application.

Click here for more information about Molex Industry 4.0 Solutions