A team of Japanese roboticists has built a new “human mimetic humanoid” that anatomically resembles the musculoskeletal intricacy of a human boy. Called Kengoro, the robot demonstrated its human-like abilities by completing a series of exercises including push-ups and sit-ups.
 New package technology improves EMI and thermal performance with smaller solution sizeSponsored by Texas Instruments Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP). Click here to download the whitepaper |
