via Boing Boing
June 5, 2012
featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'so which sci-fi and fantasy books should filmmakers tackle next?...
featured paper
 Quickly and accurately identify inter-domain leakage issues in IC designsSponsored by Siemens Digital Industries Software Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality. |
featured chalk talk
CBOT MULTIGIG Transceiver Platform
Sponsored by Mouser Electronics and TE Connectivity
In this episode of Chalk Talk, Anders Thelin from TE Connectivity and Amelia Dalton explore how the CBOT MULTIGIG transceiver platform helps address these challenges with a modular, high-performance approach to rugged, high-density connectivity. We also investigate how this platform supports next-generation system architectures, improves design efficiency, and enables robust performance in even the most demanding environments.