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Graphene-based armor could stop bullets by becoming harder than diamonds

While bullet-proof body armor does tend to be thick and heavy, that may no longer be the case if research being conducted at The City University of New York bears fruit. Led by Prof. Elisa Riedo, scientists there have determined that two layers of stacked graphene can harden to a diamond-like consistency upon impact.

Via NewAtlas

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featured blogs
Oct 27, 2020
As we continue this blog series, we'€™re going to keep looking at System Design and Verification Online Training courses. In Part 1 , we went over Verilog language and application, Xcelium simulator,... [[ Click on the title to access the full blog on the Cadence Community...
Oct 27, 2020
Back in January 2020, we rolled out a new experience for component data for our discrete wire products. This update has been very well received. In that blog post, we promised some version 2 updates that would better organize the new data. With this post, we’re happy to...
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Do you have a gadget or gizmo that uses sensors in an ingenious or frivolous way? If so, claim your 15 minutes of fame at the virtual Sensors Innovation Fall Week event....
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...

featured video

Better PPA with Innovus Mixed Placer Technology – Gigaplace XL

Sponsored by Cadence Design Systems

With the increase of on-chip storage elements, it has become extremely time consuming to come up with an optimized floorplan with manual methods. Innovus Implementation’s advanced multi-objective placement technology, GigaPlace XL, provides automation to optimize at scale, concurrent placement of macros, and standard cells for multiple objectives like timing, wirelength, congestion, and power. This technology provides an innovative way to address design productivity along with design quality improvements reducing weeks of manual floorplan time down to a few hours.

Click here for more information about Innovus Implementation System

featured paper

Overcoming PPA and Productivity Challenges of New Age ICs with Mixed Placement Innovation

Sponsored by Cadence Design Systems

With the increase in the number of on-chip storage elements, it has become extremely time consuming to come up with an optimized floorplan using manual methods, directly impacting tapeout schedules and power, performance, and area (PPA). In this white paper, learn how a breakthrough technology addresses design productivity along with design quality improvements for macro-dominated designs. Download white paper.

Click here to download the whitepaper

Featured Chalk Talk

AVX Supercapacitors: PrizmaCap

Sponsored by Mouser Electronics and AVX

If your application requires a supercapacitor, there are a lot of options. You need the right form factor, temperature range, weight, and capacitance, of course. In this episode of Chalk Talk, Amelia Dalton chats with Eric DeRose of AVX about choosing the right supercapacitor and about PrizmaCap - a new supercapacitor with low height, high temperature, and lightweight.

Click here for more information AVX PrizmaCap™