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Graphene-based armor could stop bullets by becoming harder than diamonds

While bullet-proof body armor does tend to be thick and heavy, that may no longer be the case if research being conducted at The City University of New York bears fruit. Led by Prof. Elisa Riedo, scientists there have determined that two layers of stacked graphene can harden to a diamond-like consistency upon impact.

Via NewAtlas

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featured blogs
May 16, 2021
https://youtu.be/_wup2MSTVks Made on Communication Hill, San Jose (camera Carey Guo) Monday: Intel eASIC: Linley and DARPA Tuesday: Please Excuse the Mesh: CFD and Pointwise Wednesday: Linley:... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
May 13, 2021
Samtec will attend the PCI-SIG Virtual Developers Conference on Tuesday, May 25th through Wednesday, May 26th, 2021. This is a free event for the 800+ member companies that develop and bring to market new products utilizing PCI Express technology. Attendee Registration is sti...
May 13, 2021
Our new IC design tool, PrimeSim Continuum, enables the next generation of hyper-convergent IC designs. Learn more from eeNews, Electronic Design & EE Times. The post Synopsys Makes Headlines with PrimeSim Continuum, an Innovative Circuit Simulation Solution appeared fi...
May 13, 2021
By Calibre Design Staff Prior to the availability of extreme ultraviolet (EUV) lithography, multi-patterning provided… The post A SAMPle of what you need to know about SAMP technology appeared first on Design with Calibre....

featured video

Industry’s First USB4 Silicon Success

Sponsored by Synopsys

USB4 offers up to 40Gbps speeds for incredibly fast connections. Join Synopsys to see the first demonstration of USB4 IP in silicon, along with real TX eyes for DesignWare USB4, DisplayPort, and USB 3.x IP.

Click here for more information about DesignWare USB4 IP

featured paper

Use Configurable Digital IO To Give Your Industrial Controller the Edge

Sponsored by Maxim Integrated

As factories get bigger, centralized industrial process control has become difficult to manage. While there have been attempts to simplify the task, it remains unwieldy. In this design solution, Maxim briefly reviews the centralized approach before looking at what potential changes edge computing will bring to the factory floor. They also show a digital IO IC that allows for smaller, more adaptable programmable logic controllers (PLCs) more suited to this developing architecture.

Click to read more

featured chalk talk

Complete Packaging for IIoT Devices

Sponsored by Mouser Electronics and Phoenix Contact

Industrial Internet of Things (IIoT) design brings a new level of demands to the engineering team, particularly in areas like thermal performance, reliability, and scalability. And, packaging has a key role to play. In this episode of Chalk Talk, Amelia Dalton chats with Joel Boone of Phoenix Contact about challenges and solutions in IIoT design packaging.

Click here for more information about Phoenix Contact ICS 50 Enclosure System