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Giant Antarctic iceberg breaks free

An Antarctic suspense story has come to an end with one of the largest icebergs ever observed breaking off the Larsen C Ice Shelf. The slow-motion breakup was closely monitored by scientists, who say that the 6,000 km² (2,300 mi²) ice floe now adrift in the sea is 190 m (625 ft) thick and represents 10 percent of the shelf.

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featured blogs
Dec 2, 2022
A picture tells more than a thousand words, so here are some pictures of CadenceLIVE Europe 2023 Academic and Entrepreneur Tracks to tell a story. After two years of absence, finally the Academic Dinner could take place with professors from Lead Institutions and Program Chair...
Nov 30, 2022
By Chris Clark, Senior Manager, Synopsys Automotive Group The post How Software-Defined Vehicles Expand the Automotive Revenue Stream appeared first on From Silicon To Software....
Nov 30, 2022
By Joe Davis Sponsored by France's ElectroniqueS magazine, the Electrons d'Or Award program identifies the most innovative products of the… ...
Nov 18, 2022
This bodacious beauty is better equipped than my car, with 360-degree collision avoidance sensors, party lights, and a backup camera, to name but a few....

featured video

Unique AMS Emulation Technology

Sponsored by Synopsys

Learn about Synopsys' collaboration with DARPA and other partners to develop a one-of-a-kind, high-performance AMS silicon verification capability. Please watch the video interview or read it online.

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featured paper

Algorithm Verification with FPGAs and ASICs

Sponsored by MathWorks

Developing new FPGA and ASIC designs involves implementing new algorithms, which presents challenges for verification for algorithm developers, hardware designers, and verification engineers. This eBook explores different aspects of hardware design verification and how you can use MATLAB and Simulink to reduce development effort and improve the quality of end products.

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featured chalk talk

Faster, More Predictable Path to Multi-Chiplet Design Closure

Sponsored by Cadence Design Systems

The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.

Click here for more information about Integrity 3D-IC Platform from Cadence Design Systems