In the future, your car windshield could become a giant camera sensing objects on the road. Or each window in a home could be turned into a security camera.
August 28, 2018
featured blogs
Mar 31, 2023
Learn how (and why) the semiconductor industry is moving towards chiplet-enabled multi-die systems in our research piece in MIT's Technology Review Insights.
The post An Industry-Wide Look at the Move Toward Multi-Die Systems appeared first on New Horizons for Chip Design....
Mar 31, 2023
The Verisium Debug platform is optimized for scalability, supporting debugging of simulation runs and emulation, where support for loading large source files and handling huge amounts of probe data is a must. Join this free Cadence Training Webinar to learn how to automate yo...
Mar 30, 2023
Are you in desperate need of a program manager to instigate a new project or rescue an existing project that is spiraling out of control?...
featured chalk talk
Challenges of Multi-Connectivity Asset Tracking
Sponsored by Mouser Electronics and STMicroelectronics
Multi-connectivity asset tracking is a critical element of our modern supply chain. In this episode of Chalk Talk, Colin Ramrattan and Manuel Cantone from STMicroelectronics and Amelia Dalton discuss the common needs required for asset tracking today, why low power processing is vital for these kind of applications, and how STMicroelectronics ASTRA platform can help you get started on your next asset tracking design.