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Engineers develop computerized camera without optics that uses an ordinary window as the lens

In the future, your car windshield could become a giant camera sensing objects on the road. Or each window in a home could be turned into a security camera.

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featured blogs
May 26, 2022
Introducing Synopsys Learning Center, an online, on-demand library of self-paced training modules, webinars, and labs designed for both new & experienced users. The post New Synopsys Learning Center Makes Training Easier and More Accessible appeared first on From Silico...
May 25, 2022
The Team RF "μWaveRiders" blog series is a showcase for Cadence AWR RF products. Monthly topics will vary between Cadence AWR Design Environment release highlights, feature videos, Cadence... ...
May 25, 2022
There are so many cool STEM (science, technology, engineering, and math) toys available these days, and I want them all!...
May 24, 2022
By Neel Natekar Radio frequency (RF) circuitry is an essential component of many of the critical applications we now rely… ...

featured video

EdgeQ Creates Big Connections with a Small Chip

Sponsored by Cadence Design Systems

Find out how EdgeQ delivered the world’s first 5G base station on a chip using Cadence’s logic simulation, digital implementation, timing and power signoff, synthesis, and physical verification signoff tools.

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featured paper

Introducing new dynamic features for exterior automotive lights with DLP® technology

Sponsored by Texas Instruments

Exterior lighting, primarily used to illuminate ground areas near the vehicle door, can now be transformed into a projection system used for both vehicle communication and unique styling features. A small lighting module that utilizes automotive-grade digital micromirror devices, such as the DLP2021-Q1 or DLP3021-Q1, can display an endless number of patterns in any color imaginable as well as communicate warnings and alerts to drivers and other vehicles.

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featured chalk talk

"Scalable Power Delivery" for High-Performance ASICs, SoCs, and xPUs

Sponsored by Infineon

Today’s AI and Networking applications are driving an exponential increase in compute power. When it comes to scaling power for these kinds of applications with next generation chipsets, we need to keep in mind package size constraints, dynamic current balancing, and output capacitance. In this episode of Chalk Talk, Mark Rodrigues from Infineon joins Amelia Dalton to discuss the system design challenges with increasing power density for next generation chipsets, the benefits that phase paralleling brings to the table, and why Infineon’s best in class transient performance with XDP architecture and Trans Inductor Voltage Regulator can help power  your next high performance ASIC, SoC or xPU design.

Click here for more information about computing and data storage from Infineon