EEJournal

fresh bytes
Subscribe Now
May 1, 2017

Elon Musk shows how his Boring Company plans to tunnel under traffic

by Laura Domela

Tesla and SpaceX founder Elon Musk is sharing yet another vision for the future, and this time it’s totally underground. The originator of the Hyperloop, purveyor of snazzy solar panels and man with a plan to connect our brains showed off a concept for escaping rush hour traffic via high-speed conveyance through a network of tunnels at TED in Vancouver on Friday.

Last December, Musk announced via Twitter that his irritation with Los Angeles traffic was inspiring him to start yet another company, cleverly named “The Boring Company.”

Continue reading on New Atlas

Leave a Reply

featured blogs
A Max by Any Other Name Would Smell
Nov 30, 2021
Have you ever wondered why Bill is a common nickname for William and Dick is a common nickname for Richard?...
More from Max's Cool Beans...
Just What Is Democratized Design Anyway?
Nov 30, 2021
Explore the history of the chip design process, from the days of Integrated Device Manufacturers (IDMs) to EDA tools and today's era of democratized design. The post Just What Is Democratized Design Anyway? appeared first on From Silicon To Software....
More from Synopsys...
IC Packagers: Creating and Using Non-rounded Via Stacks in Package Designs
Nov 30, 2021
The demand for smaller electronics devices can be achieved by high-density layers in multi-layer build-up substrates or multi-layered printed circuit boards (PCB). Vias are essential in the design... [[ Click on the title to access the full blog on the Cadence Community site...
More from Cadence...
We Hope to See You at Intel® FPGA Technology Day 2021
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...
More from Intel...

featured video

Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

Sponsored by Cadence Design Systems

3D stacking of ICs is emerging as a preferred solution for chip designers facing a slowdown in Moore’s Law and the rising costs of advanced nodes. However, chip stacking creates new complexities, with extra considerations required for the mechanical, electrical, and thermal aspects of the whole stacked system. Watch this video for an overview of Cadence® Integrity™ 3D-IC, a comprehensive platform for 3D planning, implementation, and system analysis, enabling system-driven PPA for multi-chiplet designs.

Click here for more information

featured paper

Building Automation and Control Systems (BACS)

Sponsored by Maxim Integrated (now part of Analog Devices)

Analog Devices' industrial communication products provide building automation engineers with a broad range of Analog IO, Digital IO, Isolation, and communication interfaces that combine low power, robust performance, and improved diagnostics in the smallest possible form factors.

Click to read more

featured chalk talk

Accelerating Innovation at the Edge with Xilinx Adaptive System on Modules

Sponsored by Xilinx

The combination of system-on-module technology with advanced SoCs with programmable logic offer the ultimate in functionality, performance, flexibility, power efficiency, and ease of use. In this episode of Chalk Talk, Amelia Dalton chats with Karan Kantharia of Xilinx about the new Kira SOM, and how it enables faster time-to-deployment versus conventional component-based design.

Click here for more information about Kria Adaptive System-on-Modules