fresh bytes
Subscribe Now

Dolce & Gabbana uses drones to model purses at fashion show

This is a video from Dolce & Gabbana’s recent ‘Secrets & Diamonds’ 2018 Fall/Winter fashion show during Milan Fashion Week starring a bunch of drones modeling the collection’s purses and handbags. How edgy! Apparently it took 45 minutes to get everybody in the audience to turn off their Wi-Fi connections (which could allegedly interfere with the performance), because if there’s one thing people love, it’s sitting around for 45 minutes with no Wi-Fi. Continue reading at Geekologie.

Leave a Reply

featured blogs
Dec 7, 2023
Semiconductor chips must be designed faster, smaller, and smarter'”with less manual work, more automation, and faster production. The Training Webinar 'Flow Wrapping: The Cadence Cerebrus Intelligent Chip Explorer Must Have' was recently hosted with me, Krishna Atreya, Princ...
Dec 6, 2023
Explore standards development and functional safety requirements with Jyotika Athavale, IEEE senior member and Senior Director of Silicon Lifecycle Management.The post Q&A With Jyotika Athavale, IEEE Champion, on Advancing Standards Development Worldwide appeared first ...
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Challenges of Multi-Connectivity Asset Tracking
Multi-connectivity asset tracking is a critical element of our modern supply chain. In this episode of Chalk Talk, Colin Ramrattan and Manuel Cantone from STMicroelectronics and Amelia Dalton discuss the common needs required for asset tracking today, why low power processing is vital for these kind of applications, and how STMicroelectronics ASTRA platform can help you get started on your next asset tracking design.
Feb 20, 2023
34,068 views