fresh bytes
Subscribe Now

DARPA working on portable and ruggedized artificial “biospleen” to fight sepsis

darpa-artificial-spleen.jpg

Today, when we think of the dangers of the battlefield, we think of wounds caused by bullets, bombs, and other weapons. But as late as the Spanish American war of 1898, the number of soldiers who died from infectious diseases as opposed to directly from combat injuries was seven to one. Thanks to the discovery of penicillin and other antibiotics, that ratio has swung dramatically the other way, but it’s still a major problem, not only for military personnel, but civilians too. DARPA is developing an artificial spleen, or “biospleen,” as a way to help fight deadly infections without antibiotics.
via Gizmag

Continue reading 

Image: DARPA

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Intel AI Update
Sponsored by Mouser Electronics and Intel
In this episode of Chalk Talk, Amelia Dalton and Peter Tea from Intel explore how Intel is making AI implementation easier than ever before. They examine the typical workflows involved in artificial intelligence designs, the benefits that Intel’s scalable Xeon processor brings to AI projects, and how you can take advantage of the Intel AI ecosystem to further innovation in your next design.
Oct 6, 2023
26,000 views